Inventor · disambiguated record
James M. Derderian
Also filed as: DERDERIAN JAMES · DERDERIAN JAMES M
56 granted patents·11 pending applications·615 citations·filing 2001–2023
98Inventor score
Files withMICRON TECHNOLOGY INC55APTINA IMAGING CORP3DERDERIAN JAMES M3ARVINMERITOR TECHNOLOGY LLC2STREET BRET K1
Top patents by PatentIndex Score
67 records- 0198US9768149B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 19, 2017·24 cites·29 claims
- 0298US6569709B2Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted May 27, 2003·176 cites·31 claims
- 0396US7675131B2Flip-chip image sensor packages and methods of fabricating the sameMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·38 cites·27 claims
- 0492US9691746B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 27, 2017·9 cites·16 claims
- 0591US11679657B1Electric drive unit and drive axle systemARVINMERITOR TECHNOLOGY LLC·Filed 2022·Granted Jun 20, 2023·4 cites·20 claims
- 0691US9515002B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 6, 2016·6 cites·20 claims
- 0790US9412675B2Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 9, 2016·8 cites·17 claims
- 0889US9733304B2Semiconductor device test apparatusesMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 15, 2017·5 cites·19 claims
- 0989US7335533B2Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one anotherMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 26, 2008·34 cites·33 claims
- 1089US7064069B2Substrate thinning including planarizationMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 20, 2006·45 cites·26 claims
- 1189US6940181B2Thinned, strengthened semiconductor substrates and packages including sameMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 6, 2005·45 cites·23 claims
- 1286US10163830B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 1386US7276393B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·33 cites·7 claims
- 1484US8012776B2Methods of manufacturing imaging device packagesMICRON TECHNOLOGY INC·Filed 2010·Granted Sep 6, 2011·6 cites·20 claims
- 1582US11679656B1Electric drive unit and drive axle systemARVINMERITOR TECHNOLOGY LLC·Filed 2022·Granted Jun 20, 2023·1 cites·20 claims
- 1682US10163693B1Methods for processing semiconductor dice and fabricating assemblies incorporating sameMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·3 cites·20 claims
- 1782US7498606B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 3, 2009·9 cites·25 claims
- 1882US7332372B2Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetweenMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 19, 2008·21 cites·33 claims
- 1982US6870269B2Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 22, 2005·22 cites·24 claims
- 2081US10861765B2Carrier removal by use of multilayer foilMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 2181US7427811B2Semiconductor substrateMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 23, 2008·8 cites·20 claims
- 2281US2023395463A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2380US10481200B2Semiconductor device test apparatuses comprising at least one test site having an array of pocketsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 19, 2019·1 cites·18 claims
- 2479US7858420B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·6 cites·12 claims
- 2579US7786574B2Microelectronic imaging unitsAPTINA IMAGING CORP·Filed 2009·Granted Aug 31, 2010·6 cites·17 claims
- 2679US7655507B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 2, 2010·6 cites·19 claims
- 2778US10126357B2Methods of testing semiconductor devices comprising a die stack having protruding conductive elementsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·1 cites·20 claims
- 2878US9837383B2Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·2 cites·14 claims
- 2977US10580746B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·1 cites·19 claims
- 3076US10573612B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 25, 2020·1 cites·17 claims
- 3176US7511374B2Microelectronic imaging units having covered image sensorsAPTINA IMAGING CORP·Filed 2006·Granted Mar 31, 2009·5 cites·30 claims
- 3275US7476955B2Die package having an adhesive flow restriction areaMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 13, 2009·17 cites·14 claims
- 3374US11776877B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 3473US10163755B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·1 cites·5 claims
- 3572US11139258B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 5, 2021·0 cites·21 claims
- 3671US6869828B2Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 22, 2005·11 cites·31 claims
- 3770US9443744B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 13, 2016·2 cites·26 claims
- 3869US7518223B2Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layerMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 14, 2009·12 cites·43 claims
- 3967US10748878B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 18, 2020·0 cites·19 claims
- 4066US10559551B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 11, 2020·0 cites·17 claims
- 4163US11967576B2Systems for thermally treating conductive elements on semiconductor and wafer structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
- 4263US8101459B2Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetweenDERDERIAN JAMES M·Filed 2004·Granted Jan 24, 2012·12 cites·27 claims
- 4363US7364934B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 29, 2008·9 cites·32 claims
- 4461US10297577B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2017·Granted May 21, 2019·0 cites·18 claims
- 4561US7691660B2Methods of manufacturing microelectronic imaging units on a microfeature workpieceAPTINA IMAGING CORP·Filed 2007·Granted Apr 6, 2010·1 cites·29 claims
- 4661US7402453B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 22, 2008·7 cites·15 claims
- 4759US2018308785A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 4857US10559495B2Methods for processing semiconductor dice and fabricating assemblies incorporating sameMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 11, 2020·0 cites·14 claims
- 4956US10431519B1Carrier removal by use of multilayer foilMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·0 cites·17 claims
- 5056US7262488B2Substrate with enhanced properties for planarizationMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 28, 2007·4 cites·11 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →