Inventor · disambiguated record
James Harnden
Also filed as: HARNDEN JAMES · HARNDEN JAMES A
44 granted patents·6 pending applications·486 citations·filing 1987–2011
98Inventor score
Top patents by PatentIndex Score
50 records- 0192USD465207SLeadframe matrix for a surface mount packageGEM SERVICES INC·Filed 2001·Granted Nov 5, 2002·50 cites·1 claims
- 0289US7057273B2Surface mount packageGEM SERVICES INC·Filed 2001·Granted Jun 6, 2006·47 cites·6 claims
- 0388US4841166ALimiting shoot-through current in a power MOSFET half-bridge during intrinsic diode recoverySILICONIX INC·Filed 1987·Granted Jun 20, 1989·41 cites·14 claims
- 0483US4853563ASwitch interface circuit for power mosfet gate drive controlSILICONIX INC·Filed 1987·Granted Aug 1, 1989·32 cites·27 claims
- 0582US7215012B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2003·Granted May 8, 2007·25 cites·6 claims
- 0682US5017804AHall sensing of bond wire currentSILICONIX INC·Filed 1989·Granted May 21, 1991·38 cites·12 claims
- 0776US7667309B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2008·Granted Feb 23, 2010·5 cites·7 claims
- 0876USD471165SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Mar 4, 2003·21 cites·1 claims
- 0966USD588080S2021-8J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 10, 2009·16 cites·1 claims
- 1058USD484858SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 6, 2004·10 cites·1 claims
- 1156US8097945B2Bi-directional, reverse blocking battery switchHARNDEN JAMES·Filed 2007·Granted Jan 17, 2012·2 cites·17 claims
- 1255USD492266SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jun 29, 2004·9 cites·1 claims
- 1355USD484859SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 6, 2004·9 cites·1 claims
- 1455USD484104SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 23, 2003·9 cites·1 claims
- 1555USD483336SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 9, 2003·9 cites·1 claims
- 1654USD588557S4040-28J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 17, 2009·10 cites·1 claims
- 1753USD488136SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Apr 6, 2004·8 cites·1 claims
- 1853USD487432SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 1953USD487431SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Mar 9, 2004·8 cites·1 claims
- 2053USD485244SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 13, 2004·8 cites·1 claims
- 2152US7485498B2Space-efficient package for laterally conducting deviceGEM SERVICES INC·Filed 2007·Granted Feb 3, 2009·0 cites·5 claims
- 2250USD485808SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 27, 2004·7 cites·1 claims
- 2350USD484103SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 23, 2003·7 cites·1 claims
- 2450USD483337SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Dec 9, 2003·7 cites·1 claims
- 2550USD462062SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 27, 2002·7 cites·1 claims
- 2650USD461172SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 6, 2002·7 cites·1 claims
- 2750US2007007640A1Surface mount packageGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 2848USD494939SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Aug 24, 2004·6 cites·1 claims
- 2948USD491900SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jun 22, 2004·6 cites·1 claims
- 3048USD486802SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Feb 17, 2004·6 cites·1 claims
- 3148USD467231SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 17, 2002·6 cites·1 claims
- 3247USD513608SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted Jan 17, 2006·6 cites·1 claims
- 3347USD505122SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 3447USD505121SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2003·Granted May 17, 2005·6 cites·1 claims
- 3547USD485243SPortion of a matrix for surface mount package leadframeGEM SERVICES INC·Filed 2002·Granted Jan 13, 2004·6 cites·1 claims
- 3647USD461170SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 6, 2002·6 cites·1 claims
- 3747US2005145998A1Surface mount packageGEM SERVICES INC·Filed 2005·Application pending·0 cites
- 3846US2008135991A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 3945USD467884SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 31, 2002·5 cites·1 claims
- 4045USD467885SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 31, 2002·5 cites·1 claims
- 4145USD467560SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Dec 24, 2002·5 cites·1 claims
- 4242USD461783SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 20, 2002·4 cites·1 claims
- 4341US2008111219A1Package designs for vertical conduction dieGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 4440US8558368B2Bi-directional, reverse blocking battery switchCHIA ANTHONY·Filed 2011·Granted Oct 15, 2013·0 cites·18 claims
- 4539USD560623SQuad-24JW surface mount packageGEM SERVICES INC·Filed 2005·Granted Jan 29, 2008·4 cites·1 claims
- 4639USD461784SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 20, 2002·3 cites·1 claims
- 4739USD461459SSurface mount packageGEM SERVICES INC·Filed 2001·Granted Aug 13, 2002·3 cites·1 claims
- 4839US2011291254A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsHARNDEN JAMES·Filed 2011·Application pending·0 cites
- 4938US2007130759A1Semiconductor device package leadframe formed from multiple metal layersGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 5036USD558694SQuad-28JW surface mount packageGEM SERVICES INC·Filed 2005·Granted Jan 1, 2008·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →