Inventor · disambiguated record
Jack Jau
Also filed as: JAU JACK · JAU JACK Y
55 granted patents·11 pending applications·1,243 citations·filing 1994–2025
98Inventor score
Top patents by PatentIndex Score
66 records- 0198US8748814B1Structure for inspecting defects in word line array fabricated by SADP process and method thereofHERMES MICROVISION INC·Filed 2013·Granted Jun 10, 2014·63 cites·16 claims
- 0297US8089297B2Structure and method for determining a defect in integrated circuit manufacturing processXIAO HONG·Filed 2008·Granted Jan 3, 2012·92 cites·9 claims
- 0397US5717204AInspecting optical masks with electron beam microscopyKLA INSTR CORP·Filed 1996·Granted Feb 10, 1998·148 cites·8 claims
- 0496US5665968AInspecting optical masks with electron beam microscopyKLA INSTR CORP·Filed 1996·Granted Sep 9, 1997·120 cites·2 claims
- 0595US10236156B2Apparatus of plural charged-particle beamsHERMES MICROVISION INC·Filed 2016·Granted Mar 19, 2019·13 cites·32 claims
- 0695US7105436B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION INC·Filed 2004·Granted Sep 12, 2006·84 cites·12 claims
- 0795US5502306AElectron beam inspection system and methodKLA INSTR CORP·Filed 1994·Granted Mar 26, 1996·400 cites·35 claims
- 0894US6815345B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION TAIWAN INC·Filed 2002·Granted Nov 9, 2004·101 cites·5 claims
- 0991US8068662B2Method and system for determining a defect during charged particle beam inspection of a sampleZhang zhao-li·Filed 2009·Granted Nov 29, 2011·46 cites·19 claims
- 1090US8294094B1Method and apparatus for reducing substrate edge effect during inspectionZHAO YAN·Filed 2011·Granted Oct 23, 2012·10 cites·26 claims
- 1189US7919760B2Operation stage for wafer edge inspection and reviewHERMES MICROVISION INC·Filed 2008·Granted Apr 5, 2011·15 cites·10 claims
- 1286US9953803B2Local alignment point calibration method in die inspectionHERMES MICROVISION INC·Filed 2016·Granted Apr 24, 2018·3 cites·24 claims
- 1386US9541824B1Method and system for fast inspecting defectsHERMES MICROVISION INC·Filed 2014·Granted Jan 10, 2017·7 cites·12 claims
- 1485US9282293B2Method and system for measuring critical dimension and monitoring fabrication uniformityHERMES MICROVISION INC·Filed 2013·Granted Mar 8, 2016·4 cites·14 claims
- 1585US8884224B2Charged particle beam imaging assembly and imaging method thereofFANG WEI·Filed 2009·Granted Nov 11, 2014·9 cites·20 claims
- 1685US8712184B1Method and system for filtering noises in an image scanned by charged particlesLIAO CHAD·Filed 2011·Granted Apr 29, 2014·20 cites·18 claims
- 1784US9400176B2Dynamic focus adjustment with optical height detection apparatus in electron beam systemHERMES MICROVISION INC·Filed 2014·Granted Jul 26, 2016·4 cites·13 claims
- 1883US10102619B1Inspection method and systemHERMES MICROVISION INC·Filed 2015·Granted Oct 16, 2018·4 cites·55 claims
- 1982US9100553B2Method and system for measuring critical dimension and monitoring fabrication uniformityHERMES MICROVISION INC·Filed 2013·Granted Aug 4, 2015·3 cites·7 claims
- 2081US9041795B2Method and system for measuring critical dimension and monitoring fabrication uniformityHERMES MICROVISION INC·Filed 2013·Granted May 26, 2015·3 cites·6 claims
- 2180US8692214B2Charged particle beam inspection methodZHAO YAN·Filed 2009·Granted Apr 8, 2014·5 cites·19 claims
- 2279US10020164B2Charged particle beam apparatusHERMES MICROVISION INC·Filed 2014·Granted Jul 10, 2018·2 cites·7 claims
- 2379US8094924B2E-beam defect review systemJAU JACK·Filed 2008·Granted Jan 10, 2012·8 cites·5 claims
- 2478US10497538B2Local alignment point calibration method in die inspectionASML NETHERLANDS BV·Filed 2018·Granted Dec 3, 2019·1 cites·18 claims
- 2578US6710342B1Method and apparatus for scanning semiconductor wafers using a scanning electron microscopeHERMES MICROVISION INC·Filed 2000·Granted Mar 23, 2004·11 cites·23 claims
- 2677US11217423B2Apparatus of plural charged-particle beamsASML NETHERLANDS BV·Filed 2019·Granted Jan 4, 2022·1 cites·18 claims
- 2777US9494856B1Method and system for fast inspecting defectsFANG WEI·Filed 2011·Granted Nov 15, 2016·2 cites·17 claims
- 2877US8937281B2Method for examining a sample by using a charged particle beamZHAO YAN·Filed 2012·Granted Jan 20, 2015·3 cites·22 claims
- 2976US10380731B1Method and system for fast inspecting defectsHERMES MICROVISION INC·Filed 2015·Granted Aug 13, 2019·2 cites·7 claims
- 3076US8606017B1Method for inspecting localized image and system thereofFANG WEI·Filed 2011·Granted Dec 10, 2013·7 cites·26 claims
- 3176US8432441B2Method and system for measuring critical dimension and monitoring fabrication uniformityFANG WEI·Filed 2011·Granted Apr 30, 2013·3 cites·4 claims
- 3276US8010307B2In-line overlay measurement using charged particle beam systemHERMES MICROVISION INC·Filed 2007·Granted Aug 30, 2011·5 cites·13 claims
- 3376US7973283B2Method for regulating scanning sample surface charge in continuous and leap-and-scan scanning mode imaging processHERMES MICROVISION INC·Filed 2008·Granted Jul 5, 2011·3 cites·20 claims
- 3475US11880971B2Inspection method and systemASML NETHERLANDS BV·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 3575US8299431B2Method for examining a sample by using a charged particle beamZHAO YAN·Filed 2009·Granted Oct 30, 2012·3 cites·20 claims
- 3675US7884334B2Charged particle beam imaging method and system thereofHERMES MICROVISION INC·Filed 2009·Granted Feb 8, 2011·3 cites·23 claims
- 3774US8050490B2Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereofHERMES MICROVISION INC·Filed 2009·Granted Nov 1, 2011·4 cites·25 claims
- 3873US7474001B2Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturingHERMES MICROVISION INC·Filed 2006·Granted Jan 6, 2009·4 cites·5 claims
- 3972US9190241B2Charged particle beam apparatusHERMES MICROVISION INC·Filed 2014·Granted Nov 17, 2015·1 cites·4 claims
- 4072US2025226175A1Dynamic determination of a sample inspection recipe of charged particle beam inspectionASML NETHERLANDS BV·Filed 2025·Application pending·0 cites
- 4172US2020251305A1Charged particle beam apparatusASML NETHERLANDS BV·Filed 2020·Application pending·0 cites
- 4271US6881956B1Method and apparatus for scanning semiconductor wafers using a scanning electron microscopeHERMES MICROVISION INC·Filed 2003·Granted Apr 19, 2005·7 cites·20 claims
- 4370US11250559B2Inspection method and systemASML NETHERLANDS BV·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 4470US8748815B2Method and system for detecting or reviewing open contacts on a semiconductor deviceZHAO FREDERICK Y·Filed 2006·Granted Jun 10, 2014·11 cites·58 claims
- 4569US9436988B2Method and system of classifying defects on a waferHERMES-MICROVISION INC·Filed 2014·Granted Sep 6, 2016·2 cites·15 claims
- 4668US9965844B1Inspection method and systemHERMES MICROVISION INC·Filed 2016·Granted May 8, 2018·1 cites·23 claims
- 4766US8791414B2Dynamic focus adjustment with optical height detection apparatus in electron beam systemWANG JOE·Filed 2010·Granted Jul 29, 2014·2 cites·7 claims
- 4865US11043356B2Local alignment point calibration method in die inspectionASML NETHERLANDS BV·Filed 2019·Granted Jun 22, 2021·0 cites·24 claims
- 4965US9177758B2Charged particle beam apparatusHERMES MICROVISION INC·Filed 2014·Granted Nov 3, 2015·1 cites·23 claims
- 5063US10679340B2Inspection method and systemASML NETHERLANDS BV·Filed 2018·Granted Jun 9, 2020·0 cites·17 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →