Inventor · disambiguated record
Jatinder Kumar
Also filed as: KUMAR JATINDER
18 granted patents·2 pending applications·69 citations·filing 2006–2024
91Inventor score
Files withLENOVO SINGAPORE PTE LTD7APPLIED MATERIALS INC3KRISHNAN SHUTESH2MOTOROLA MOBILITY LLC2SEMICONDUCTOR COMPONENTS IND2
Top patents by PatentIndex Score
20 records- 0196US10622189B2Adjustable side gas plenum for edge rate control in a downstream reactorLAM RES CORP·Filed 2016·Granted Apr 14, 2020·27 cites·7 claims
- 0287US9740894B1Silent RFID state and restore backMOTOROLA MOBILITY LLC·Filed 2016·Granted Aug 22, 2017·6 cites·20 claims
- 0383US12253476B2Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing systemAPPLIED MATERIALS INC·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
- 0482US8268676B2Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leadsKRISHNAN SHUTESH·Filed 2010·Granted Sep 18, 2012·6 cites·18 claims
- 0580US10770036B2Presentation of content on left and right eye portions of headsetLENOVO SINGAPORE PTE LTD·Filed 2018·Granted Sep 8, 2020·2 cites·20 claims
- 0679US11874234B2Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing systemAPPLIED MATERIALS INC·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 0777US11087538B2Presentation of augmented reality images at display locations that do not obstruct user's viewLENOVO SINGAPORE PTE LTD·Filed 2018·Granted Aug 10, 2021·3 cites·20 claims
- 0874US11585764B1Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing systemAPPLIED MATERIALS INC·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 0970US7402895B2Semiconductor package structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jul 22, 2008·5 cites·20 claims
- 1069US8519521B2Electronic device including a packaging substrate having a trenchKRISHNAN SHUTESH·Filed 2012·Granted Aug 27, 2013·2 cites·20 claims
- 1166US7939380B2Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structureSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 10, 2011·3 cites·24 claims
- 1264US10614794B2Adjust output characteristicLENOVO SINGAPORE PTE LTD·Filed 2017·Granted Apr 7, 2020·1 cites·5 claims
- 1362USD958490SUnderwearPATENTMANIAC CONSULTING·Filed 2019·Granted Jul 26, 2022·13 cites·1 claims
- 1456US8525321B2Conductive chip disposed on lead semiconductor packageKUMAR JATINDER·Filed 2011·Granted Sep 3, 2013·1 cites·21 claims
- 1549US2013307134A1Conductive chip disposed on lead semiconductor package and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2013·Application pending·0 cites
- 1648US11665158B2Wireless signal authentication via biometric pattern detectionLENOVO SINGAPORE PTE LTD·Filed 2020·Granted May 30, 2023·0 cites·14 claims
- 1747US11200877B2Face mask for facilitating conversationsLENOVO SINGAPORE PTE LTD·Filed 2020·Granted Dec 14, 2021·0 cites·20 claims
- 1844US2020090343A1Establish device connection based on detecting a movement pattern on a cameraMOTOROLA MOBILITY LLC·Filed 2018·Application pending·0 cites
- 1943US10789425B2Generating a response to a natural language command based on a concatenated graphLENOVO SINGAPORE PTE LTD·Filed 2017·Granted Sep 29, 2020·0 cites·9 claims
- 2043US10741175B2Systems and methods for natural language understanding using sensor inputLENOVO SINGAPORE PTE LTD·Filed 2016·Granted Aug 11, 2020·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Jatinder Kumar files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →