Inventor · disambiguated record
James S. Papanu
Also filed as: PAPANU JAMES · PAPANU JAMES S
64 granted patents·17 pending applications·2,430 citations·filing 1994–2024
99Inventor score
Top patents by PatentIndex Score
81 records- 0198US9076860B1Residue removal from singulated die sidewallLEI WEI-SHENG·Filed 2014·Granted Jul 7, 2015·49 cites·22 claims
- 0298US8975163B1Laser-dominated laser scribing and plasma etch hybrid wafer dicingLEI WEI-SHENG·Filed 2014·Granted Mar 10, 2015·43 cites·21 claims
- 0398US5885358AGas injection slit nozzle for a plasma process reactorAPPLIED MATERIALS INC·Filed 1996·Granted Mar 23, 1999·203 cites·30 claims
- 0498US5643394AGas injection slit nozzle for a plasma process reactorAPPLIED MATERIALS INC·Filed 1994·Granted Jul 1, 1997·215 cites·73 claims
- 0597US9130057B1Hybrid dicing process using a blade and laserKUMAR PRABHAT·Filed 2014·Granted Sep 8, 2015·49 cites·20 claims
- 0697US6692903B2Substrate cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2000·Granted Feb 17, 2004·414 cites·49 claims
- 0797US5746875AGas injection slit nozzle for a plasma process reactorAPPLIED MATERIALS INC·Filed 1995·Granted May 5, 1998·169 cites·18 claims
- 0896US7604708B2Cleaning of native oxide with hydrogen-containing radicalsAPPLIED MATERIALS INC·Filed 2004·Granted Oct 20, 2009·226 cites·16 claims
- 0996US5756400AMethod and apparatus for cleaning by-products from plasma chamber surfacesAPPLIED MATERIALS INC·Filed 1995·Granted May 26, 1998·407 cites·13 claims
- 1095US9355907B1Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch processLEI WEI-SHENG·Filed 2015·Granted May 31, 2016·14 cites·17 claims
- 1195US9165832B1Method of die singulation using laser ablation and induction of internal defects with a laserPAPANU JAMES S·Filed 2014·Granted Oct 20, 2015·53 cites·20 claims
- 1295US8991329B1Wafer coatingAPPLIED MATERIALS INC·Filed 2014·Granted Mar 31, 2015·19 cites·20 claims
- 1394US8883615B1Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processesHOLDEN JAMES MATTHEW·Filed 2014·Granted Nov 11, 2014·33 cites·19 claims
- 1493US9601375B2UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Mar 21, 2017·9 cites·17 claims
- 1593US9159624B1Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approachLEI WEI-SHENG·Filed 2015·Granted Oct 13, 2015·9 cites·16 claims
- 1693US9093518B1Singulation of wafers having wafer-level underfillLEI WEI-SHENG·Filed 2014·Granted Jul 28, 2015·16 cites·26 claims
- 1793US8912078B1Dicing wafers having solder bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Dec 16, 2014·13 cites·20 claims
- 1892US9012305B1Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening cleanLEI WEI-SHENG·Filed 2014·Granted Apr 21, 2015·12 cites·15 claims
- 1991US5545289APassivating, stripping and corrosion inhibition of semiconductor substratesAPPLIED MATERIALS INC·Filed 1994·Granted Aug 13, 1996·184 cites·91 claims
- 2089US8932939B1Water soluble mask formation by dry film laminationLEI WEI-SHENG·Filed 2014·Granted Jan 13, 2015·7 cites·20 claims
- 2189US7694688B2Wet clean system designAPPLIED MATERIALS INC·Filed 2007·Granted Apr 13, 2010·20 cites·24 claims
- 2288US10903121B1Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted Jan 26, 2021·4 cites·20 claims
- 2387US9245803B1Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·7 cites·14 claims
- 2487US9130056B1Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicingHOLDEN JAMES M·Filed 2014·Granted Sep 8, 2015·7 cites·30 claims
- 2587US9041198B2Maskless hybrid laser scribing and plasma etching wafer dicing processLEI WEI-SHENG·Filed 2013·Granted May 26, 2015·6 cites·4 claims
- 2687US5817534ARF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafersAPPLIED MATERIALS INC·Filed 1995·Granted Oct 6, 1998·94 cites·23 claims
- 2786US9852997B2Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2016·Granted Dec 26, 2017·4 cites·12 claims
- 2884US9972575B2Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2016·Granted May 15, 2018·3 cites·13 claims
- 2984US9196536B1Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch processPARK JUNGRAE·Filed 2014·Granted Nov 24, 2015·6 cites·21 claims
- 3084US9130030B1Baking tool for improved wafer coating processAPPLIED MATERIALS INC·Filed 2014·Granted Sep 8, 2015·5 cites·24 claims
- 3184US6991739B2Method of photoresist removal in the presence of a dielectric layer having a low k-valueAPPLIED MATERIALS INC·Filed 2001·Granted Jan 31, 2006·34 cites·26 claims
- 3283US8927393B1Water soluble mask formation by dry film vacuum lamination for laser and plasma dicingLEI WEI-SHENG·Filed 2014·Granted Jan 6, 2015·5 cites·6 claims
- 3383US7432177B2Post-ion implant cleaning for silicon on insulator substrate preparationAPPLIED MATERIALS INC·Filed 2005·Granted Oct 7, 2008·7 cites·21 claims
- 3482US9177861B1Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profilePARK JUNGRAE·Filed 2014·Granted Nov 3, 2015·5 cites·20 claims
- 3582US8002899B2Method and apparatus for mask pellicle adhesive residue cleaningAPPLIED MATERIALS INC·Filed 2008·Granted Aug 23, 2011·21 cites·24 claims
- 3681US9412619B2Method of outgassing a mask material deposited over a workpiece in a process toolAPPLIED MATERIALS INC·Filed 2014·Granted Aug 9, 2016·4 cites·14 claims
- 3774US7718009B2Cleaning submicron structures on a semiconductor wafer surfaceAPPLIED MATERIALS INC·Filed 2004·Granted May 18, 2010·18 cites·19 claims
- 3872US11764061B2Water soluble organic-inorganic hybrid mask formulations and their applicationsAPPLIED MATERIALS INC·Filed 2021·Granted Sep 19, 2023·0 cites·22 claims
- 3971US2024079273A1Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approachAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4069US9275902B2Dicing processes for thin wafers with bumps on wafer backsideLEI WEI-SHENG·Filed 2014·Granted Mar 1, 2016·2 cites·25 claims
- 4168US9793132B1Etch mask for hybrid laser scribing and plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2016·Granted Oct 17, 2017·1 cites·27 claims
- 4267US9209084B2Maskless hybrid laser scribing and plasma etching wafer dicing processLEI WEI-SHENG·Filed 2014·Granted Dec 8, 2015·1 cites·6 claims
- 4365US9443765B2Water soluble mask formation by dry film vacuum lamination for laser and plasma dicingLEI WEI-SHENG·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 4465US9343366B2Dicing wafers having solder bumps on wafer backsideAPPLIED MATERIALS INC·Filed 2014·Granted May 17, 2016·1 cites·7 claims
- 4565US9299611B2Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistanceLEI WEI-SHENG·Filed 2014·Granted Mar 29, 2016·1 cites·26 claims
- 4665US9281244B1Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch processPARK JUNGRAE·Filed 2014·Granted Mar 8, 2016·1 cites·8 claims
- 4764US7914623B2Post-ion implant cleaning for silicon on insulator substrate preparationAPPLIED MATERIALS INC·Filed 2007·Granted Mar 29, 2011·1 cites·7 claims
- 4863US11854888B2Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approachAPPLIED MATERIALS INC·Filed 2020·Granted Dec 26, 2023·0 cites·7 claims
- 4963US11211247B2Water soluble organic-inorganic hybrid mask formulations and their applicationsAPPLIED MATERIALS INC·Filed 2020·Granted Dec 28, 2021·0 cites·14 claims
- 5063US2023187215A1Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →