Inventor · disambiguated record
Jae M. Park
Also filed as: PARK JAE · PARK JAE M · PARK JAE MUN
14 granted patents·8 pending applications·730 citations·filing 2003–2020
94Inventor score
Top patents by PatentIndex Score
22 records- 0198US7495179B2Components with posts and padsTESSERA INC·Filed 2005·Granted Feb 24, 2009·70 cites·14 claims
- 0298US7176506B2High frequency chip packages with connecting elementsTESSERA INC·Filed 2003·Granted Feb 13, 2007·320 cites·18 claims
- 0397US7659617B2Substrate for a flexible microelectronic assembly and a method of fabricating thereofTESSERA INC·Filed 2006·Granted Feb 9, 2010·49 cites·23 claims
- 0494US8207604B2Microelectronic package comprising offset conductive posts on compliant layerHABA BELGACEM·Filed 2004·Granted Jun 26, 2012·93 cites·20 claims
- 0594US7368695B2Image sensor package and fabrication methodTESSERA INC·Filed 2005·Granted May 6, 2008·50 cites·21 claims
- 0692US7053485B2Microelectronic packages with self-aligning featuresTESSERA INC·Filed 2003·Granted May 30, 2006·76 cites·10 claims
- 0789US8641913B2Fine pitch microcontacts and method for forming thereofHABA BELGACEM·Filed 2007·Granted Feb 4, 2014·17 cites·25 claims
- 0884US7397068B2Solid state lighting deviceTESSERA INC·Filed 2004·Granted Jul 8, 2008·37 cites·15 claims
- 0980US8604348B2Method of making a connection component with posts and padsKUBOTA YOICHI·Filed 2011·Granted Dec 10, 2013·4 cites·27 claims
- 1078US8046912B2Method of making a connection component with posts and padsTESSERA INC·Filed 2009·Granted Nov 1, 2011·5 cites·15 claims
- 1163US7268304B2Microelectronic connection components having bondable wiresTESSERA INC·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 1262US7763983B2Stackable microelectronic device carriers, stacked device carriers and methods of making the sameTESSERA INC·Filed 2007·Granted Jul 27, 2010·2 cites·9 claims
- 1359US2014145329A1Fine pitch microcontacts and method for forming thereofTESSERA INC·Filed 2014·Application pending·0 cites
- 1456US2014262460A1Connection Component with Posts and PadsTESSERA INC·Filed 2013·Application pending·0 cites
- 1553US7304376B2Microelectronic assemblies with springsTESSERA INC·Filed 2004·Granted Dec 4, 2007·4 cites·30 claims
- 1651US2007096160A1High frequency chip packages with connecting elementsTESSERA INC·Filed 2006·Application pending·0 cites
- 1744US2008185705A1Microelectronic packages and methods thereforTESSERA INC·Filed 2007·Application pending·0 cites
- 1841US2006223227A1Molding method for foldover packageTESSERA INC·Filed 2005·Application pending·0 cites
- 1940US2005139984A1Package element and packaged chip having severable electrically conductive tiesTESSERA INC·Filed 2004·Application pending·0 cites
- 2039US2006038542A1Solid state lighting deviceTESSERA INC·Filed 2004·Application pending·0 cites
- 2136US2021157303A1Smart factory control system using smart plug for plantOS LAB CO LTD·Filed 2020·Application pending·0 cites
- 2230US10865603B2Core drill apparatus for installation in excavatorPARK JAE MUN·Filed 2016·Granted Dec 15, 2020·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →