Inventor · disambiguated record
Jae Beom Shim
Also filed as: SHIM JAE BEOM
14 granted patents·5 pending applications·139 citations·filing 2009–2025
88Inventor score
Top patents by PatentIndex Score
19 records- 0197US11557524B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 17, 2023·4 cites·20 claims
- 0297US7977783B1Wafer level chip size package having redistribution layersAMKOR TECHNOLOGY INC·Filed 2009·Granted Jul 12, 2011·132 cites·16 claims
- 0387US11355470B2Semiconductor device and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·16 claims
- 0485US12288728B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Apr 29, 2025·0 cites·20 claims
- 0584US12261145B2Semiconductor device and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 25, 2025·1 cites·16 claims
- 0682US2025233035A1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0780US12388018B2Device chip scale package including a protective layer and method of manufacturing a device chip scale packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0880US11978687B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted May 7, 2024·0 cites·20 claims
- 0971US11990411B2Device chip scale package including a protective layerAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 21, 2024·0 cites·21 claims
- 1070US12278196B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1170US2025192093A1SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICEsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1267US12489101B2Electronic devices having inner electronic component interposed between substrates and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 1362US11018067B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·21 claims
- 1460US2025336740A1Electronic devices and a methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1557US11830823B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 28, 2023·0 cites·19 claims
- 1654US2024096858A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 1754US2020335441A1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Application pending·0 cites
- 1850US11121077B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Sep 14, 2021·0 cites·22 claims
- 1940US10141270B2Semiconductor device and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 27, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →