Inventor · disambiguated record
James V. Tietz
Also filed as: EMAMI RAMIN · TIETZ JAMES V
26 granted patents·3 pending applications·2,622 citations·filing 1996–2013
98Inventor score
Top patents by PatentIndex Score
29 records- 0199US5879128ALift pin and support pin apparatus for a processing chamberAPPLIED MATERIALS INC·Filed 1996·Granted Mar 9, 1999·607 cites·39 claims
- 0298US5781693AGas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetweenAPPLIED MATERIALS INC·Filed 1996·Granted Jul 14, 1998·909 cites·28 claims
- 0396US6090210AMulti-zone gas flow control in a process chamberAPPLIED MATERIALS INC·Filed 1996·Granted Jul 18, 2000·234 cites·16 claims
- 0495US6916746B1Method for plasma etching using periodic modulation of gas chemistryLAM RES CORP·Filed 2003·Granted Jul 12, 2005·77 cites·16 claims
- 0594US6413873B1System for chemical mechanical planarizationAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·85 cites·3 claims
- 0694US6302767B1Chemical mechanical polishing with a polishing sheet and a support sheetAPPLIED MATERIALS INC·Filed 2000·Granted Oct 16, 2001·44 cites·28 claims
- 0792US6135859AChemical mechanical polishing with a polishing sheet and a support sheetAPPLIED MATERIALS INC·Filed 1999·Granted Oct 24, 2000·95 cites·29 claims
- 0891US7881886B1Methods for performing transient flow prediction and verification using discharge coefficientsLAM RES CORP·Filed 2007·Granted Feb 1, 2011·26 cites·9 claims
- 0990US5960555AMethod and apparatus for purging the back side of a substrate during chemical vapor processingAPPLIED MATERIALS INC·Filed 1997·Granted Oct 5, 1999·92 cites·24 claims
- 1089US8521461B2Apparatus for delivering a process gasSHAREEF IQBAL A·Filed 2012·Granted Aug 27, 2013·10 cites·21 claims
- 1186US6157106AMagnetically-levitated rotor system for an RTP chamberAPPLIED MATERIALS INC·Filed 1997·Granted Dec 5, 2000·79 cites·11 claims
- 1285US9234775B2Methods for verifying gas flow rates from a gas supply system into a plasma processing chamberLAM RES CORP·Filed 2013·Granted Jan 12, 2016·6 cites·25 claims
- 1384US5848889ASemiconductor wafer support with graded thermal massAPPLIED MATERIALS INC·Filed 1996·Granted Dec 15, 1998·74 cites·27 claims
- 1482US7294580B2Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon additionLAM RES CORP·Filed 2004·Granted Nov 13, 2007·29 cites·20 claims
- 1582US7014538B2Article for polishing semiconductor substratesAPPLIED MATERIALS INC·Filed 2003·Granted Mar 21, 2006·27 cites·32 claims
- 1679US5884412AMethod and apparatus for purging the back side of a substrate during chemical vapor processingAPPLIED MATERIALS INC·Filed 1996·Granted Mar 23, 1999·49 cites·24 claims
- 1777US7822570B2Methods for performing actual flow verificationLAM RES CORP·Filed 2007·Granted Oct 26, 2010·8 cites·19 claims
- 1877US6123766AMethod and apparatus for achieving temperature uniformity of a substrateAPPLIED MATERIALS INC·Filed 1997·Granted Sep 26, 2000·37 cites·15 claims
- 1973US6133152ACo-rotating edge ring extension for use in a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 1997·Granted Oct 17, 2000·43 cites·22 claims
- 2072US7166535B2Plasma etching of silicon carbideLAM RES CORP·Filed 2003·Granted Jan 23, 2007·11 cites·26 claims
- 2164US6273794B1Apparatus and method for grinding a semiconductor wafer surfaceAPPLIED MATERIALS INC·Filed 2000·Granted Aug 14, 2001·8 cites·20 claims
- 2261US5920797AMethod for gaseous substrate supportAPPLIED MATERIALS INC·Filed 1996·Granted Jul 6, 1999·25 cites·22 claims
- 2360US6035100AReflector cover for a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 1997·Granted Mar 7, 2000·25 cites·22 claims
- 2459US8150646B2Methods for delivering a process gasSHAREEF IQBAL A·Filed 2010·Granted Apr 3, 2012·1 cites·20 claims
- 2556US7311852B2Method of plasma etching low-k dielectric materialsLAM RES CORP·Filed 2001·Granted Dec 25, 2007·6 cites·23 claims
- 2656US6132295AApparatus and method for grinding a semiconductor wafer surfaceAPPLIED MATERIALS INC·Filed 1999·Granted Oct 17, 2000·15 cites·24 claims
- 2748US2005136682A1Method for plasma etching using periodic modulation of gas chemistryLAM RES CORP·Filed 2005·Application pending·0 cites
- 2841US2007021935A1Methods for verifying gas flow rates from a gas supply system into a plasma processing chamberLARSON DEAN J·Filed 2005·Application pending·0 cites
- 2936US2002077037A1Fixed abrasive articlesFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when James V. Tietz files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →