Inventor · disambiguated record
Jaroslaw W. Winniczek
Also filed as: WINNICZEK JAROSLAW W · WINNICZEK JAROSLAW WALERY
24 granted patents·4 pending applications·1,414 citations·filing 1998–2021
96Inventor score
Top patents by PatentIndex Score
28 records- 0198US8425682B2High strip rate downstream chamberLAM RES CORP·Filed 2012·Granted Apr 23, 2013·378 cites·16 claims
- 0297US6255221B1Methods for running a high density plasma etcher to achieve reduced transistor device damageLAM RES CORP·Filed 1998·Granted Jul 3, 2001·369 cites·29 claims
- 0396US8298336B2High strip rate downstream chamberWANG ING-YANN·Filed 2005·Granted Oct 30, 2012·384 cites·28 claims
- 0496US6969619B1Full spectrum endpoint detectionNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 29, 2005·126 cites·19 claims
- 0587US8598037B2Silicon etch with passivation using plasma enhanced oxidationWINNICZEK JAROSLAW W·Filed 2011·Granted Dec 3, 2013·7 cites·18 claims
- 0687US6093332AMethods for reducing mask erosion during plasma etchingLAM RES CORP·Filed 1998·Granted Jul 25, 2000·46 cites·14 claims
- 0785US8043434B2Method and apparatus for removing photoresistLAM RES CORP·Filed 2008·Granted Oct 25, 2011·8 cites·17 claims
- 0884US8173547B2Silicon etch with passivation using plasma enhanced oxidationWINNICZEK JAROSLAW W·Filed 2008·Granted May 8, 2012·8 cites·19 claims
- 0983US6489245B1Methods for reducing mask erosion during plasma etchingLAM RES CORP·Filed 2000·Granted Dec 3, 2002·16 cites·8 claims
- 1081US9865472B2Fabrication of a silicon structure and deep silicon etch with profile controlLAM RES CORP·Filed 2016·Granted Jan 9, 2018·3 cites·13 claims
- 1176US11050984B1Image quality detection and correction systemCAPTUREPROOF INC·Filed 2019·Granted Jun 29, 2021·2 cites·20 claims
- 1276US7542134B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2008·Granted Jun 2, 2009·4 cites·9 claims
- 1375US9330926B2Fabrication of a silicon structure and deep silicon etch with profile controlCHEBI ROBERT·Filed 2008·Granted May 3, 2016·7 cites·32 claims
- 1474US7605063B2Photoresist stripping chamber and methods of etching photoresist on substratesLAM RES CORP·Filed 2006·Granted Oct 20, 2009·5 cites·20 claims
- 1574US6562187B2Methods and apparatus for determining an etch endpoint in a plasma processing systemLAM RES CORP·Filed 2001·Granted May 13, 2003·16 cites·24 claims
- 1670US9018098B2Silicon etch with passivation using chemical vapor depositionWINNICZEK JAROSLAW W·Filed 2008·Granted Apr 28, 2015·3 cites·15 claims
- 1767US11116442B1Image integrity and repeatability systemCAPTUREPROOF INC·Filed 2019·Granted Sep 14, 2021·1 cites·10 claims
- 1866US8871105B2Method for achieving smooth side walls after Bosch etch processWINNICZEK JAROSLAW W·Filed 2012·Granted Oct 28, 2014·2 cites·19 claims
- 1966US6228278B1Methods and apparatus for determining an etch endpoint in a plasma processing systemLAM RES CORP·Filed 1998·Granted May 8, 2001·28 cites·10 claims
- 2064US11872050B1Image integrity and repeatability systemCAPTUREPROOF INC·Filed 2021·Granted Jan 16, 2024·0 cites·14 claims
- 2156US11303868B1Image quality detection and correction systemCAPTUREPROOF INC·Filed 2021·Granted Apr 12, 2022·0 cites·20 claims
- 2256US7397555B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2004·Granted Jul 8, 2008·1 cites·10 claims
- 2345US8757178B2Method and apparatus for removing photoresistCHEBI ROBERT P·Filed 2011·Granted Jun 24, 2014·0 cites·14 claims
- 2441US2014261803A1High strip rate downstream chamberLAM RES CORP·Filed 2013·Application pending·0 cites
- 2540US8609548B2Method for providing high etch rateXU QING·Filed 2011·Granted Dec 17, 2013·0 cites·12 claims
- 2639US2002029853A1Methods for running a high density plasma etcher to achieve reduced transistor device damageFiled 2001·Application pending·0 cites
- 2739US2013203259A1Pressure control valve assembly of plasma processing chamber and rapid alternating processWINNICZEK JAROSLAW W·Filed 2012·Application pending·0 cites
- 2838US2003183335A1Methods and apparatus for determining an etch endpoint in a plasma processing systemFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →