Inventor · disambiguated record
Jeongbyung Chae
Also filed as: CHAE JEONGBYUNG
3 granted patents·1 pending application·7 citations·filing 2018–2024
61Inventor score
Top patents by PatentIndex Score
4 records- 0186US10672715B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·6 cites·18 claims
- 0279US2025105165A1Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0377US11410935B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 0471US12165986B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →