Inventor · disambiguated record
Jerome S. Hubacek
Also filed as: HUBACEK JEROME · HUBACEK JEROME S
13 granted patents·8 pending applications·1,202 citations·filing 1998–2025
95Inventor score
Top patents by PatentIndex Score
21 records- 0198US12278125B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Apr 15, 2025·8 cites·19 claims
- 0298US12183604B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Dec 31, 2024·9 cites·37 claims
- 0398US6073577AElectrode for plasma processes and method for manufacture and use thereofLAM RES CORP·Filed 1998·Granted Jun 13, 2000·242 cites·9 claims
- 0497US6475336B1Electrostatically clamped edge ring for plasma processingLAM RES CORP·Filed 2000·Granted Nov 5, 2002·234 cites·23 claims
- 0597US6376385B2Method of manufacturing assembly for plasma reaction chamber and use thereofLAM RES CORP·Filed 2001·Granted Apr 23, 2002·99 cites·14 claims
- 0697US6194322B1Electrode for plasma processes and method for a manufacture and use thereofLAM RES CORP·Filed 2000·Granted Feb 27, 2001·89 cites·14 claims
- 0796US6451157B1Gas distribution apparatus for semiconductor processingLAM RES CORP·Filed 1999·Granted Sep 17, 2002·290 cites·20 claims
- 0894US6148765AElectrode for plasma processes and method for manufacture and use thereofLAM RES CORP·Filed 1999·Granted Nov 21, 2000·72 cites·18 claims
- 0992US6408786B1Semiconductor processing equipment having tiled ceramic linerLAM RES CORP·Filed 1999·Granted Jun 25, 2002·97 cites·20 claims
- 1090US8845855B2Electrode for plasma processes and method for manufacture and use thereofHUBACEK JEROME S·Filed 2007·Granted Sep 30, 2014·23 cites·8 claims
- 1183US6846726B2Silicon parts having reduced metallic impurity concentration for plasma reaction chambersLAM RES CORP·Filed 2002·Granted Jan 25, 2005·18 cites·26 claims
- 1280US2025246460A1Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2025·Application pending·0 cites
- 1371US7442114B2Methods for silicon electrode assembly etch rate and etch uniformity recoveryLAM RES CORP·Filed 2004·Granted Oct 28, 2008·14 cites·19 claims
- 1471US2023045336A1Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2021·Application pending·0 cites
- 1570US7517803B2Silicon parts having reduced metallic impurity concentration for plasma reaction chambersLAM RES CORP·Filed 2004·Granted Apr 14, 2009·7 cites·20 claims
- 1654US2025125165A1Apparatuses for radiative heating of an edge region of a semiconductor waferLAM RES CORP·Filed 2022·Application pending·0 cites
- 1753US2024355650A1Dry development apparatus and methods for volatilization of dry development byproducts in wafersLAM RES CORP·Filed 2022·Application pending·0 cites
- 1853US2022413276A1Reflective fourier ptychography imaging of large surfacesLAM RES CORP·Filed 2020·Application pending·0 cites
- 1950US2023348311A1Additive manufacturing of silicon componentsLAM RES CORP·Filed 2021·Application pending·0 cites
- 2041US2022285134A1Near netshape additive manufacturing using low temperature plasma jetsLAM RES CORP·Filed 2020·Application pending·0 cites
- 2139US2002127853A1Electrode for plasma processes and method for manufacture and use thereofFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →