Inventor · disambiguated record
Jengyi Yu
Also filed as: YU JENGYI
36 granted patents·14 pending applications·414 citations·filing 1999–2025
98Inventor score
Top patents by PatentIndex Score
50 records- 0198US12278125B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Apr 15, 2025·8 cites·19 claims
- 0298US12183604B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Dec 31, 2024·9 cites·37 claims
- 0398US12094711B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Sep 17, 2024·5 cites·18 claims
- 0498US11257674B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2020·Granted Feb 22, 2022·15 cites·19 claims
- 0597US12105422B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2020·Granted Oct 1, 2024·13 cites·12 claims
- 0697US11848212B2Alternating etch and passivation processLAM RES CORP·Filed 2022·Granted Dec 19, 2023·10 cites·14 claims
- 0797US11551938B2Alternating etch and passivation processLAM RES CORP·Filed 2020·Granted Jan 10, 2023·13 cites·21 claims
- 0897US10796912B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2018·Granted Oct 6, 2020·18 cites·16 claims
- 0997US10546748B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2018·Granted Jan 28, 2020·25 cites·20 claims
- 1097US9837312B1Atomic layer etching for enhanced bottom-up feature fillLAM RES CORP·Filed 2016·Granted Dec 5, 2017·48 cites·20 claims
- 1196US12293919B2Alternating etch and passivation processLAM RES CORP·Filed 2023·Granted May 6, 2025·3 cites·15 claims
- 1296US12183589B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2021·Granted Dec 31, 2024·3 cites·20 claims
- 1396US11322351B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2019·Granted May 3, 2022·15 cites·32 claims
- 1496US10269566B2Etching substrates using ale and selective depositionLAM RES CORP·Filed 2017·Granted Apr 23, 2019·15 cites·24 claims
- 1595US12510825B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2024·Granted Dec 30, 2025·2 cites·33 claims
- 1695US12510826B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2024·Granted Dec 30, 2025·2 cites·12 claims
- 1795US11988965B2Underlayer for photoresist adhesion and dose reductionLAM RES CORP·Filed 2021·Granted May 21, 2024·13 cites·42 claims
- 1895US11355353B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2019·Granted Jun 7, 2022·15 cites·15 claims
- 1995US11314168B2Underlayer for photoresist adhesion and dose reductionLAM RES CORP·Filed 2021·Granted Apr 26, 2022·24 cites·79 claims
- 2095US10685836B2Etching substrates using ALE and selective depositionLAM RES CORP·Filed 2019·Granted Jun 16, 2020·10 cites·20 claims
- 2194US12474638B2Underlayer for photoresist adhesion and dose reductionLAM RES CORP·Filed 2024·Granted Nov 18, 2025·2 cites·63 claims
- 2293US12062538B2Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvementLAM RES CORP·Filed 2020·Granted Aug 13, 2024·3 cites·32 claims
- 2393US11842888B2Removing metal contamination from surfaces of a processing chamberLAM RES CORP·Filed 2022·Granted Dec 12, 2023·1 cites·24 claims
- 2491US7482245B1Stress profile modulation in STI gap fillNOVELLUS SYSTEMS INC·Filed 2006·Granted Jan 27, 2009·22 cites·22 claims
- 2590US12437995B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Oct 7, 2025·1 cites·5 claims
- 2689US8268722B2Interfacial capping layers for interconnectsYU JENGYI·Filed 2010·Granted Sep 18, 2012·13 cites·23 claims
- 2787US12417916B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Sep 16, 2025·1 cites·16 claims
- 2887US12191125B2Removing metal contamination from surfaces of a processing chamberLAM RES CORP·Filed 2023·Granted Jan 7, 2025·0 cites·18 claims
- 2987US7163896B1Biased H2 etch process in deposition-etch-deposition gap fillNOVELLUS SYSTEMS INC·Filed 2003·Granted Jan 16, 2007·58 cites·20 claims
- 3084US2025328076A1Underlayer for photoresist adhesion and dose reductionLAM RES CORP·Filed 2025·Application pending·0 cites
- 3182US6764952B1Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copperNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 20, 2004·28 cites·25 claims
- 3280US2025087498A1Tin oxide mandrels in patterningLAM RES CORP·Filed 2024·Application pending·0 cites
- 3380US2025246460A1Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2025·Application pending·0 cites
- 3478US12027375B2Selective etch using a sacrificial maskLAM RES CORP·Filed 2020·Granted Jul 2, 2024·1 cites·21 claims
- 3574US12315727B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2021·Granted May 27, 2025·0 cites·13 claims
- 3673US2022037132A1Removing metal contamination from surfaces of a processing chamberLAM RES CORP·Filed 2019·Application pending·0 cites
- 3773US2024429045A1Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvementLAM RES CORP·Filed 2024·Application pending·0 cites
- 3871US2023045336A1Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2021·Application pending·0 cites
- 3970US8753978B2Metal and silicon containing capping layers for interconnectsYU JENGYI·Filed 2012·Granted Jun 17, 2014·2 cites·21 claims
- 4066US12417902B2Method for cleaning a chamberLAM RES CORP·Filed 2021·Granted Sep 16, 2025·0 cites·22 claims
- 4158US2024329539A1Multi-step post-exposure treatment to improve dry development performance of metal-containing resistLAM RES CORP·Filed 2022·Application pending·0 cites
- 4256US6822333B1Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Nov 23, 2004·6 cites·12 claims
- 4353US2014216336A1Metal and silicon containing capping layers for interconnectsNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 4451US2025093781A1Rework of metal-containing photoresistLAM RES CORP·Filed 2022·Application pending·0 cites
- 4549US2024036474A1Control of metallic contamination from metal-containing photoresistLAM RES CORP·Filed 2022·Application pending·0 cites
- 4647US2023314954A1Dry backside and bevel edge clean of photoresistLAM RES CORP·Filed 2021·Application pending·0 cites
- 4747US2024192590A1Apparatus and process for euv dry resist sensitization by gas phase infusion of a sensitizerLAM RES CORP·Filed 2021·Application pending·0 cites
- 4846US2023031955A1Post application/exposure treatments to improve dry development performance of metal-containing euv resistLAM RES CORP·Filed 2021·Application pending·0 cites
- 4945US6303496B1Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuitCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Oct 16, 2001·10 cites·15 claims
- 5044US2022344136A1Dry chamber clean of photoresist filmsLAM RES CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →