Inventor · disambiguated record
Jhih-Bin Chen
Also filed as: CHEN JHIH-BIN
18 granted patents·8 pending applications·11 citations·filing 2013–2025
89Inventor score
Top patents by PatentIndex Score
26 records- 0195US11329128B2High voltage device with gate extensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·3 cites·20 claims
- 0284US12211896B2High voltage device with gate extensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
- 0383US2025254936A1High voltage device with gate extensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0482US12255207B2Boundary design for high-voltage integration on HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0582US11437785B2VCSEL with self-aligned microlens to improve beam divergenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·2 cites·20 claims
- 0681US11211469B2Third generation flash memory structure with self-aligned contact and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·1 cites·20 claims
- 0778US12237647B2Techniques for vertical cavity surface emitting laser oxidationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 0877US2025221032A1Boundary design for high-voltage integration on hkmg technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US11908891B2High voltage device with gate extensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 1075US11855091B2Boundary design for high-voltage integration on HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1175US10643964B2Structures for bonding a group III-V device to a substrate by stacked conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 1275US2022311214A1Vcsel with self-aligned microlens to improve beam divergenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1373US2025056877A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1472US11309685B2Techniques for vertical cavity surface emitting laser oxidationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 1572US9353061B23,5,N-trihydroxy-alkanamide and derivatives: method for making same and use thereofACADEMIA SINICA·Filed 2013·Granted May 31, 2016·4 cites·28 claims
- 1668US11410999B2Boundary design for high-voltage integration on HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 1767US11784460B2Bump bonding structure to mitigate space contamination for III-V dies and CMOS diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 1865US12159870B2Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 1964US11158593B2Structures for bonding a group III-V device to a substrate by stacked conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
- 2058US11025033B2Bump bonding structure to mitigate space contamination for III-V dies and CMOS diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 2158US2025133969A1Resistive memory cell top electrode contact with reduced corner erosion and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2257US2025311361A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2356US2025081480A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2451US2024047542A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2549US10847949B2Techniques for vertical cavity surface emitting laser oxidationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·0 cites·20 claims
- 2646US9115116B2Dual action inhibitors against histone deacetylases and 3-hydroxy-3-methylglutaryl coenzyme a reductaseACADEMIA SINICA·Filed 2014·Granted Aug 25, 2015·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →