Inventor · disambiguated record
Jingbin Feng
Also filed as: FENG JINGBIN
33 granted patents·674 citations·filing 1997–2023
97Inventor score
Top patents by PatentIndex Score
33 records- 0198US8262871B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN T·Filed 2009·Granted Sep 11, 2012·55 cites·21 claims
- 0297US6193859B1Electric potential shaping apparatus for holding a semiconductor wafer during electroplatingNOVELLUS SYSTEMS INC·Filed 1998·Granted Feb 27, 2001·159 cites·29 claims
- 0397US6159354AElectric potential shaping method for electroplatingNOVELLUS SYSTEMS INC·Filed 1997·Granted Dec 12, 2000·182 cites·12 claims
- 0495US9677188B2Electrofill vacuum plating cellNOVELLUS SYSTEMS INC·Filed 2013·Granted Jun 13, 2017·8 cites·27 claims
- 0595US9309604B2Method and apparatus for electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 12, 2016·18 cites·20 claims
- 0695US9228270B2Lipseals and contact elements for semiconductor electroplating apparatusesFENG JINGBIN·Filed 2012·Granted Jan 5, 2016·16 cites·10 claims
- 0795US8475644B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·36 cites·20 claims
- 0894US11401623B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2021·Granted Aug 2, 2022·3 cites·26 claims
- 0994US10435807B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2015·Granted Oct 8, 2019·5 cites·7 claims
- 1094US9988734B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2015·Granted Jun 5, 2018·6 cites·22 claims
- 1194US8475636B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·30 cites·19 claims
- 1293US11859300B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2022·Granted Jan 2, 2024·2 cites·18 claims
- 1393US8475637B2Electroplating apparatus with vented electrolyte manifoldFENG JINGBIN·Filed 2008·Granted Jul 2, 2013·14 cites·24 claims
- 1492US9816194B2Control of electrolyte flow dynamics for uniform electroplatingLAM RES CORP·Filed 2015·Granted Nov 14, 2017·8 cites·14 claims
- 1590US7690324B1Small-volume electroless plating cellNOVELLUS SYSTEMS INC·Filed 2005·Granted Apr 6, 2010·21 cites·32 claims
- 1690US6713122B1Methods and apparatus for airflow and heat management in electroless platingNOVELLUS SYSTEMS INC·Filed 2002·Granted Mar 30, 2004·44 cites·42 claims
- 1789US8172646B2Magnetically actuated chuck for edge bevel removalFENG JINGBIN·Filed 2009·Granted May 8, 2012·16 cites·27 claims
- 1887US11512408B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2018·Granted Nov 29, 2022·1 cites·17 claims
- 1987US10927475B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2018·Granted Feb 23, 2021·4 cites·16 claims
- 2085US12157950B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 2184US9028657B2Front referenced anodeFENG JINGBIN·Filed 2010·Granted May 12, 2015·5 cites·13 claims
- 2281US12392049B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 2380US9340893B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2015·Granted May 17, 2016·2 cites·14 claims
- 2480US6967174B1Wafer chuck for use in edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 22, 2005·23 cites·15 claims
- 2578US8540857B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN·Filed 2012·Granted Sep 24, 2013·1 cites·22 claims
- 2672US9512538B2Plating cup with contoured cup bottomHE ZHIAN·Filed 2012·Granted Dec 6, 2016·1 cites·16 claims
- 2771US10351968B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2016·Granted Jul 16, 2019·1 cites·24 claims
- 2871US9945044B2Method for uniform flow behavior in an electroplating cellLAM RES CORP·Filed 2013·Granted Apr 17, 2018·2 cites·20 claims
- 2966US8257781B1Electroless plating-liquid systemWEBB ERIC G·Filed 2005·Granted Sep 4, 2012·5 cites·77 claims
- 3062US10053792B2Plating cup with contoured cup bottomNOVELLUS SYSTEMS INC·Filed 2016·Granted Aug 21, 2018·0 cites·6 claims
- 3155US10711364B2Uniform flow behavior in an electroplating cellLAM RES CORP·Filed 2018·Granted Jul 14, 2020·0 cites·22 claims
- 3246US10969036B2High flow multi-way piston valve for deposition systemsLAM RES CORP·Filed 2018·Granted Apr 6, 2021·0 cites·10 claims
- 3344USD668211SSegmented electroplating anode and anode segmentFENG JINGBIN·Filed 2010·Granted Oct 2, 2012·6 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →