Inventor · disambiguated record
Jin-Hao Jhang
Also filed as: JHANG JIN-HAO
3 granted patents·13 pending applications·0 citations·filing 2021–2025
44Inventor score
Top patents by PatentIndex Score
16 records- 0177US2025351548A1Dielectric materials for stacked transistor structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0276US2025336683A1Planarization process and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0371US2025246436A1Planarization process and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0469US2025159968A1Dielectric materials for stacked transistor structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0569US2025329647A1Stacked transistors with vertical interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0668US2025178159A1Polishing apparatus and method for polishing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0767US12466979B2CMP composition including anionic and cationic inhibitorsCMC MAT LLC·Filed 2024·Granted Nov 11, 2025·0 cites·4 claims
- 0866US2025233070A1Stacked transistors with vertical interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0960US2024174891A1Titanium dioxide chemical-mechanical polishing composition for polishing nickel substratesENTEGRIS INC·Filed 2023·Application pending·0 cites
- 1058US12234382B2CMP composition including anionic and cationic inhibitorsCMC MAT INC·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 1158US2025242465A1Hybrid abrasive system for ru cmpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1255US2025112050A1Polishing apparatus having beam for surface treatment and polishing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1354US2025201582A1Manufacturing method of heat dissipation layer and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1454US2025221012A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1551US2025108475A1Polishing apparatus and polishing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1650US11629271B2Titanium dioxide containing ruthenium chemical mechanical polishing slurryCMC MAT INC·Filed 2021·Granted Apr 18, 2023·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →