Inventor · disambiguated record
Jin Seong Kim
Also filed as: KIM JIN S · KIM JIN SEONG · KIM JIN Y
81 granted patents·20 pending applications·414 citations·filing 2003–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC26AMKOR TECH SINGAPORE HOLDING PTE LTD25LG DISPLAY CO LTD12SAMSUNG ELECTRO MECH7HYUNDAI MOTOR CO LTD6
Top patents by PatentIndex Score
101 records- 0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
- 0296US8525318B1Semiconductor device and fabricating method thereofKIM JIN SEONG·Filed 2010·Granted Sep 3, 2013·148 cites·19 claims
- 0395US11855000B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0495US9935083B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 3, 2018·21 cites·20 claims
- 0595US9728476B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 8, 2017·11 cites·7 claims
- 0694US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
- 0794US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
- 0894US9984947B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 29, 2018·9 cites·13 claims
- 0994US9711485B1Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 18, 2017·14 cites·15 claims
- 1094US8557629B1Semiconductor device having overlapped via aperturesKIM JIN SEONG·Filed 2010·Granted Oct 15, 2013·31 cites·11 claims
- 1193US11966549B2Touch display apparatusLG DISPLAY CO LTD·Filed 2023·Granted Apr 23, 2024·1 cites·17 claims
- 1293US10347562B1Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 1392US2025355528A1Touch Display ApparatusLG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 1491US9721872B1Methods and structures for increasing the allowable die size in TMV packagesNICHOLLS LOUIS W·Filed 2012·Granted Aug 1, 2017·16 cites·21 claims
- 1590US9620693B2Light emitting device and lighting system having the sameLG INNOTEK CO LTD·Filed 2016·Granted Apr 11, 2017·8 cites·20 claims
- 1687US9766764B2Touch display apparatusLG DISPLAY CO LTD·Filed 2015·Granted Sep 19, 2017·3 cites·19 claims
- 1786US10490332B2InductorSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 26, 2019·2 cites·28 claims
- 1886US10444924B2Touch display apparatusLG DISPLAY CO LTD·Filed 2018·Granted Oct 15, 2019·1 cites·17 claims
- 1986US9219208B2Light emitting device and lighting system including the sameLG INNOTEK CO LTD·Filed 2013·Granted Dec 22, 2015·9 cites·20 claims
- 2086US2024321658A1Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2185US12393312B2Touch display apparatusLG DISPLAY CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·15 claims
- 2285US8089145B1Semiconductor device including increased capacity leadframeKIM GWANG HO·Filed 2008·Granted Jan 3, 2012·20 cites·20 claims
- 2385US7091571B1Image sensor package and method for manufacture thereofAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 15, 2006·34 cites·20 claims
- 2484US11158582B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Oct 26, 2021·3 cites·19 claims
- 2584US10108283B2Touch display apparatusLG DISPLAY CO LTD·Filed 2016·Granted Oct 23, 2018·1 cites·19 claims
- 2683US12451441B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Oct 21, 2025·0 cites·17 claims
- 2783US12002725B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 4, 2024·0 cites·31 claims
- 2882US12494414B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 2982US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3082US2025309129A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 3182US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3281US11355449B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 3381US9837331B1Semiconductor device having overlapped via aperturesAMKOR TECHNOLOGY INC·Filed 2015·Granted Dec 5, 2017·3 cites·20 claims
- 3480US12334450B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 17, 2025·0 cites·13 claims
- 3580US11031356B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·2 cites·5 claims
- 3680US10297552B2Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnectsAMKOR TECHNOLOGY INC·Filed 2016·Granted May 21, 2019·3 cites·20 claims
- 3780US9917063B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Mar 13, 2018·4 cites·16 claims
- 3880US9343427B2Manufacturing method of semiconductor device and semiconductor device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2014·Granted May 17, 2016·5 cites·20 claims
- 3979US9177932B1Semiconductor device having overlapped via aperturesAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 4077US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 4176US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 4276US11682598B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 20, 2023·0 cites·11 claims
- 4376US10818637B2Thin bonded interposer packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Oct 27, 2020·1 cites·19 claims
- 4475US11579733B2Touch display apparatusLG DISPLAY CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·17 claims
- 4575US10714408B2Semiconductor devices and methods of making semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2019·Granted Jul 14, 2020·1 cites·21 claims
- 4675US9778529B2In-cell touch liquid crystal display apparatus, method of manufacturing the same, method of manufacturing thin film transistor array substrate, and method of manufacturing color filter array substrateLG DISPLAY CO LTD·Filed 2015·Granted Oct 3, 2017·1 cites·7 claims
- 4775US9541254B2Light emitting device and lighting system having the sameLG INNOTEK CO LTD·Filed 2013·Granted Jan 10, 2017·4 cites·20 claims
- 4875US9502392B2Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnectsAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 22, 2016·3 cites·19 claims
- 4973US10811341B2Semiconductor device with through-mold viaAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·1 cites·20 claims
- 5073US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →