Inventor · disambiguated record
Jincheol Kim
Also filed as: KIM JINCHEOL
18 granted patents·11 pending applications·11 citations·filing 2008–2024
88Inventor score
Top patents by PatentIndex Score
29 records- 0193US11437308B2Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatusABSOLICS INC·Filed 2021·Granted Sep 6, 2022·3 cites·14 claims
- 0291US11209762B2Method for error handling in the toner refill processHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Dec 28, 2021·6 cites·20 claims
- 0386US12456653B2Packaging substrate and semiconductor device comprising the sameABSOLICS INC·Filed 2022·Granted Oct 28, 2025·1 cites·8 claims
- 0479US12181805B2Method for error handling in the toner refill processHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Dec 31, 2024·0 cites·16 claims
- 0578US12027454B1Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Jul 2, 2024·0 cites·10 claims
- 0677US12198994B2Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2020·Granted Jan 14, 2025·1 cites·9 claims
- 0775US11728259B2Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2022·Granted Aug 15, 2023·0 cites·10 claims
- 0874US2025096055A1Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 0971US11892781B2Method for error handling in the toner refill processHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Feb 6, 2024·0 cites·15 claims
- 1071US11469167B2Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2021·Granted Oct 11, 2022·0 cites·10 claims
- 1170US12288742B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2023·Granted Apr 29, 2025·0 cites·5 claims
- 1267US12456672B2Packaging substrate having element group in cavity unit and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Oct 28, 2025·0 cites·12 claims
- 1365US2025079289A1Substrate and manufacturing method for the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1464US2025218797A1Manufacturing method for packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 1561US12469736B2Substrate carrier and substrate assembly comprising the sameABSOLICS INC·Filed 2022·Granted Nov 11, 2025·0 cites·10 claims
- 1661US2025079190A1Substrate and manufacturing method for the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1761US2025183055A1Manufacturing method for a packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 1861US2024387342A1Substrate with embedded elements and manufacturing method of the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1957US11652039B2Packaging substrate with core layer and cavity structure and semiconductor device comprising the sameABSOLICS INC·Filed 2020·Granted May 16, 2023·0 cites·9 claims
- 2056US2022165650A1Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2020·Application pending·0 cites
- 2154US2023028070A1Substrate comprising a lid structure, package substrate comprising the same and semiconductor deviceABSOLICS INC·Filed 2022·Application pending·0 cites
- 2254US2024021507A1Via connection structure comprising multiple vias and substrate comprising the sameABSOLICS INC·Filed 2022·Application pending·0 cites
- 2353US11320774B2Estimation of toner remaining rateHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted May 3, 2022·0 cites·15 claims
- 2453US2024336519A1Substrate and package substrate comprising the sameABSOLICS INC·Filed 2022·Application pending·0 cites
- 2550US12165979B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2021·Granted Dec 10, 2024·0 cites·10 claims
- 2649US11981501B2Loading cassette for substrate including glass and substrate loading method to which same is appliedABSOLICS INC·Filed 2020·Granted May 14, 2024·0 cites·10 claims
- 2747US11967542B2Packaging substrate, and semiconductor device comprising sameABSOLICS INC·Filed 2020·Granted Apr 23, 2024·0 cites·10 claims
- 2846US11437088B2Memory device including row decodersSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 6, 2022·0 cites·20 claims
- 2946US2010192531A1Filter medium for air filter and air filterNIPPON MUKI KK·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →