Inventor · disambiguated record
Jinsu Kwon
Also filed as: KWON JINSU
6 granted patents·2 pending applications·97 citations·filing 2003–2014
84Inventor score
Top patents by PatentIndex Score
8 records- 0193US8558379B2Flip chip interconnection with double postKWON JINSU·Filed 2008·Granted Oct 15, 2013·54 cites·32 claims
- 0279US9282640B2Interconnection element with posts formed by platingTESSERA INC·Filed 2013·Granted Mar 8, 2016·5 cites·19 claims
- 0379US8505199B2Method of fabricating an interconnection element having conductive postsKWON JINSU·Filed 2008·Granted Aug 13, 2013·8 cites·26 claims
- 0476US7253504B1Integrated circuit package and methodADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 7, 2007·23 cites·22 claims
- 0575US8884448B2Flip chip interconnection with double postKWON JINSU·Filed 2010·Granted Nov 11, 2014·4 cites·16 claims
- 0652US2015054153A1Flip chip interconnection with double postTESSERA INC·Filed 2014·Application pending·0 cites
- 0746US6842662B1Method and apparatus for fully aligned flip-chip assembly having a variable pitch packaging substrateADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 11, 2005·3 cites·18 claims
- 0832US2014138811A1A semiconductor device including a heat-spreading lidNVIDIA CORP·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →