Inventor · disambiguated record
Ji Hun Lee
Also filed as: LEE JI HUN
48 granted patents·28 pending applications·167 citations·filing 2008–2025
97Inventor score
Files withAMKOR TECHNOLOGY INC14AMKOR TECH SINGAPORE HOLDING PTE LTD12SAMSUNG ELECTRONICS CO LTD12JUSUNG ENG CO LTD10LG DISPLAY CO LTD5
Top patents by PatentIndex Score
76 records- 0198US9000586B2Semiconductor device and manufacturing method thereofDO WON CHUL·Filed 2012·Granted Apr 7, 2015·49 cites·20 claims
- 0297US11392243B2Display deviceLG DISPLAY CO LTD·Filed 2021·Granted Jul 19, 2022·4 cites·13 claims
- 0396US11809657B2Display deviceLG DISPLAY CO LTD·Filed 2022·Granted Nov 7, 2023·2 cites·18 claims
- 0496US11061505B2Display deviceLG DISPLAY CO LTD·Filed 2019·Granted Jul 13, 2021·10 cites·25 claims
- 0595US9941180B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 10, 2018·28 cites·19 claims
- 0694US11065939B2Motor-driven air vent device for vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jul 20, 2021·9 cites·11 claims
- 0794US10741788B2Display deviceLG DISPLAY CO LTD·Filed 2019·Granted Aug 11, 2020·7 cites·20 claims
- 0892US10008393B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 26, 2018·7 cites·22 claims
- 0991US9966276B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·5 cites·20 claims
- 1090US10297466B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 21, 2019·4 cites·20 claims
- 1189US12362099B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Jul 15, 2025·1 cites·20 claims
- 1288US11630553B2Electronic device and method for displaying history of executed application thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 18, 2023·1 cites·9 claims
- 1388US10963131B2Electronic device and method for displaying history of executed application thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 30, 2021·2 cites·20 claims
- 1488US10649627B2Electronic device and method for displaying history of executed application thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·4 cites·11 claims
- 1588US9437575B1Semiconductor device package formed in a chip-on-wafer last process using thin film adhesivesAMKOR TECHNOLOGY INC·Filed 2014·Granted Sep 6, 2016·8 cites·19 claims
- 1687US10388582B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·5 cites·20 claims
- 1787US9741701B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·4 cites·20 claims
- 1885US9536858B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 1984US10034085B2Class-D amplifier, audio processing apparatus and method of driving class-D amplifierKOREA ADVANCED INST SCI & TECH·Filed 2016·Granted Jul 24, 2018·5 cites·15 claims
- 2084US2024332032A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2182US10290621B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2017·Granted May 14, 2019·2 cites·20 claims
- 2280US12255197B2Package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 2379US11225126B2Motor driven air vent device for vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jan 18, 2022·2 cites·12 claims
- 2479US2025158007A1Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2578US12340068B2Electronic device and method for displaying history of executed application thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·15 claims
- 2675US11948808B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 2775US11501978B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 2873US12459825B2Hydrophobic aerogel and method for manufacturing the sameUIF UNIV INDUSTRY FOUNDATION YONSEI UNIV·Filed 2022·Granted Nov 4, 2025·0 cites·3 claims
- 2973US11508712B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 3071US11287954B2Electronic device and method for displaying history of executed application thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 29, 2022·0 cites·9 claims
- 3170US11210050B2Display control method, storage medium and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 28, 2021·2 cites·9 claims
- 3270US11195726B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Dec 7, 2021·0 cites·13 claims
- 3370US9196601B2Semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 24, 2015·3 cites·20 claims
- 3469US2024371612A1Substrate processing apparatusJUSUNG ENG CO LTD·Filed 2024·Application pending·0 cites
- 3568US12507571B2Display device including a first capping layer disposed on a light-emitting elementLG DISPLAY CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·17 claims
- 3668US2025275126A1Semiconductor memory device and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3764US10985031B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Apr 20, 2021·0 cites·21 claims
- 3863US10867984B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Dec 15, 2020·0 cites·6 claims
- 3962US2025336738A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4060US10981833B2Multi-layered ceramic electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Apr 20, 2021·0 cites·21 claims
- 4160US10553451B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
- 4257US2025207697A1Substrate processing apparatusJUSUNG ENG CO LTD·Filed 2023·Application pending·0 cites
- 4356US2023085592A1Substrate processing apparatus and substrate processing methodJUSUNG ENG CO LTD·Filed 2021·Application pending·0 cites
- 4456US2024154587A1Class-d audio amplification circuitry and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4556US2024322449A1Antenna apparatusKMW INC·Filed 2024·Application pending·0 cites
- 4655US10629951B2Electrolyte composition and a sodium ion battery comprising the sameSOLVAY·Filed 2014·Granted Apr 21, 2020·0 cites·13 claims
- 4755US2025101776A1Locking mechanism for console device and vehicular console device including sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 4855US2025034710A1Substrate processing apparatusJUSUNG ENG CO LTD·Filed 2022·Application pending·0 cites
- 4955US2024313431A1Rf module and antenna apparatus including the sameKMW INC·Filed 2024·Application pending·0 cites
- 5055US2025069856A1Apparatus for processing substrateJUSUNG ENG CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →