Inventor · disambiguated record
Jianbin Luo
Also filed as: LUO JIANBIN
4 granted patents·6 pending applications·8 citations·filing 2007–2025
60Inventor score
Top patents by PatentIndex Score
10 records- 0178US9138857B2Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the sameLU XINCHUN·Filed 2011·Granted Sep 22, 2015·8 cites·14 claims
- 0252US12409941B1Parameter setting method, device and multi-rotor droneSHENZHEN HOBBYWING TECH CO LTD·Filed 2025·Granted Sep 9, 2025·0 cites·12 claims
- 0351US2024410916A1Friction regulation method, apparatus and system for molybdenum disulfideUNIV TSINGHUA·Filed 2019·Application pending·0 cites
- 0449US2025003893A1Method for monitoring influence of defects in few-layer two-dimensional material on exciton transportUNIV TSINGHUA·Filed 2020·Application pending·0 cites
- 0540US10739377B2Numerically controlled rotary probe switching device based on environment-controllable atomic force microscopeUNIV SOUTHWEST JIAOTONG·Filed 2019·Granted Aug 11, 2020·0 cites·9 claims
- 0639US10739379B2Methods for designing and processing a microcantilever-based probe with an irregular cross section applied in an ultra-low friction coefficient measurement at a nanoscale single-point contactUNIV SOUTHWEST JIAOTONG·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 0738US2010078067A1Carbon nanotube film based solar cell and fabricating method thereofJIA YI·Filed 2007·Application pending·0 cites
- 0834US2012115403A1Pad conditioner head for conditioning a polishing padLU XINCHUN·Filed 2011·Application pending·0 cites
- 0934US2012315826A1Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the DeviceLU XINCHUN·Filed 2011·Application pending·0 cites
- 1032US2013000845A1Device and Method for Measuring Thickness of Slurry and Chemical Mechanical Polishing Apparatus Comprising the DeviceUNIV TSINGHUA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →