Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device

Abstract

The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry. According to the device for measuring the physical parameters of the slurry of an embodiment of the present disclosure, the physical parameters of slurry between the polishing head and the polishing pad may be in-suit measured and obtained. The present disclosure further discloses a chemical mechanical polishing apparatus having the device for measuring the physical parameters of the slurry.

1 . A device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus, the chemical mechanical polishing apparatus comprising a polishing head, a rotary table, a polishing platen disposed on an upper surface of the rotary table, and a polishing pad disposed on an upper surface of the polishing platen and opposed to the polishing head and having a through-hole, the device comprising:
 a sensor disposed in the polishing platen and adapted to contact the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry;   a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal from the sensor into a standard electrical signal; and   a processing unit coupled to the converter for acquiring the standard electrical signal to obtain the physical parameters of the slurry.   
     
     
         2 . The device according to  claim 1 , wherein a first groove is formed in the upper surface of the rotary table and covered by the polishing platen to define a first chamber in which the converter is disposed. 
     
     
         3 . The device according to  claim 1 , wherein a second groove is formed in the upper surface of the polishing platen and covered by the polishing pad to define a second chamber, and the sensor is disposed in the second chamber and corresponds to the through-hole. 
     
     
         4 . The device according to  claim 3 , further comprising a mounting panel disposed in the second chamber, and the sensor is mounted on the mounting panel. 
     
     
         5 . The device according to  claim 4 , wherein a plurality of through-holes are formed and arranged along a radial direction of the polishing platen at intervals, and a plurality of sensors are provided and arranged along the radial direction of the polishing platen at intervals and correspond to the plurality of through-holes respectively. 
     
     
         6 . The device according to  claim 5 , wherein the plurality of through-holes are arranged along the radial direction of the polishing platen at equal intervals, and the plurality of sensors are arranged along the radial direction of the polishing platen at equal intervals. 
     
     
         7 . The device according to  claim 5 , wherein the plurality of through-holes are arranged along a plurality of radial directions of the polishing disk, and the plurality of sensors are arranged in a plurality of one-dimensional linear arrays along the plurality of radial directions of the polishing disk. 
     
     
         8 . The device according to  claim 7 , wherein a plurality of mounting panels are provided and the plurality of one-dimensional linear arrays of the sensors are correspondingly mounted on the plurality of mounting panels. 
     
     
         9 . The device according to  claim 1 , wherein the sensor is a temperature sensor and/or a pressure sensor, and the converter is a temperature converter and/or a pressure converter, in which the temperature sensor is coupled to the temperature converter, and the pressure sensor is coupled to the pressure converter. 
     
     
         10 . The device according to  claim 1 , wherein the processing unit comprises:
 a slip ring having a rotating part mounted on the rotary table and coupled to the converter, in which a rotating central axis of the rotating part of the slip ring coincides with a rotating central axis of the rotary table;   an acquisition card coupled to a static part of the slip ring for acquiring the standard electrical signal;   a signal converter coupled to the acquisition card for converting the standard electrical signal into a digital signal;   a calculation module coupled to the signal converter for calculating the physical parameters of the slurry using the digital signal; and   a display terminal coupled to the calculation module for displaying the physical parameters of the slurry.   
     
     
         11 . A chemical mechanical polishing apparatus, comprising:
 a rotary table;   a polishing platen disposed on an upper surface of the rotary table;   a polishing pad disposed on an upper surface of the polishing platen and having a through-hole;   a polishing head opposed to the polishing pad; and   a device for measuring physical parameters of a slurry, the device comprising:
 a sensor disposed in the polishing platen and adapted to contact the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; 
 a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal from the sensor into a standard electrical signal; and 
   a processing unit coupled to the converter for acquiring the standard electrical signal to obtain the physical parameters of the slurry.   
     
     
         12 . The chemical mechanical polishing apparatus according to  claim 11 , wherein a first groove is formed in the upper surface of the rotary table and covered by the polishing platen to define a first chamber in which the converter is disposed. 
     
     
         13 . The chemical mechanical polishing apparatus according to  claim 11 , a second groove is formed in the upper surface of the polishing platen and covered by the polishing pad to define a second chamber, and the sensor is disposed in the second chamber and corresponds to the through-hole. 
     
     
         14 . A method for measuring physical parameters of a slurry, comprising:
 A) during a chemical mechanical polishing process, sector scanning a whole surface of a wafer and measuring physical parameters of a slurry to obtain a measuring signal using the sensor of a device for measuring physical parameters of the slurry, the device comprising: a sensor disposed in the polishing platen and adapted to contact the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal from the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to obtain the physical parameters of the slurry; and   B) converting the measuring signal from the sensor into a standard electrical signal using the converter, then acquiring the standard electrical signal at a predetermined frequency using the processing unit to obtain the physical parameters of the slurry.   
     
     
         15 . The method according to  claim 14 , wherein the sensor is a temperature sensor and/or a pressure sensor for measuring a temperature and/or a pressure of the slurry.