Inventor · disambiguated record
Jihoon Oh
Also filed as: OH JIHOON
22 granted patents·2 pending applications·189 citations·filing 2008–2025
95Inventor score
Top patents by PatentIndex Score
24 records- 0193US10050227B2Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2017·Granted Aug 14, 2018·12 cites·20 claims
- 0293US8343810B2Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layersSTATS CHIPPAC LTD·Filed 2010·Granted Jan 1, 2013·18 cites·30 claims
- 0393US8004093B2Integrated circuit package stacking systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 23, 2011·37 cites·18 claims
- 0492US8836114B2Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layersSTATS CHIPPAC LTD·Filed 2012·Granted Sep 16, 2014·15 cites·31 claims
- 0592US8003496B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieSTATS CHIPPAC LTD·Filed 2009·Granted Aug 23, 2011·22 cites·21 claims
- 0692US7683469B2Package-on-package system with heat spreaderSTATS CHIPPAC LTD·Filed 2008·Granted Mar 23, 2010·32 cites·20 claims
- 0787US10217807B2Anisotropic conductive film and display device using the sameSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Feb 26, 2019·6 cites·10 claims
- 0887US9401347B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVSTATS CHIPPAC LTD·Filed 2015·Granted Jul 26, 2016·5 cites·24 claims
- 0986US8531012B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVLEE SINJAE·Filed 2009·Granted Sep 10, 2013·13 cites·22 claims
- 1085US9379064B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieSTATS CHIPPAC LTD·Filed 2015·Granted Jun 28, 2016·4 cites·25 claims
- 1179US8432028B2Integrated circuit packaging system with package-on-package and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Apr 30, 2013·8 cites·20 claims
- 1277US10672853B2Flexible display apparatusSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Jun 2, 2020·3 cites·19 claims
- 1374US9048209B2Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieOH JIHOON·Filed 2011·Granted Jun 2, 2015·4 cites·28 claims
- 1472US8937371B2Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSVSTATS CHIPPAC LTD·Filed 2013·Granted Jan 20, 2015·2 cites·24 claims
- 1569US11683963B2Anisotropic conductive film and display device using the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Jun 20, 2023·1 cites·16 claims
- 1669US8569870B1Integrated circuit packaging system with shielding spacer and method of manufacture thereofLEE SINJAE·Filed 2012·Granted Oct 29, 2013·3 cites·10 claims
- 1768US2025393438A1Display device, electronic device and method for manufacturing the display deviceSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 1865US9196213B2Gate driving circuit and display device having the sameSAMSUNG DISPLAY CO LTD·Filed 2014·Granted Nov 24, 2015·2 cites·20 claims
- 1964US8310038B2Integrated circuit packaging system with embedded conductive structure and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Nov 13, 2012·2 cites·20 claims
- 2055US10088703B2Method of manufacturing display deviceSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Oct 2, 2018·0 cites·15 claims
- 2154US11226696B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 2241US9933655B2Polarizer and display device comprising the sameSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Apr 3, 2018·0 cites·18 claims
- 2333US8709932B2Integrated circuit packaging system with interconnects and method of manufacture thereofLEE SOO WON·Filed 2010·Granted Apr 29, 2014·0 cites·20 claims
- 2432US2017373032A1Redistribution layer (rdl) fan-out wafer level packaging (fowlp) structureQUALCOMM INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →