Inventor · disambiguated record
Jingang Su
Also filed as: SU JINGANG
9 granted patents·6 pending applications·485 citations·filing 1999–2023
89Inventor score
Top patents by PatentIndex Score
15 records- 0196US6110836AReactive plasma etch cleaning of high aspect ratio openingsAPPLIED MATERIALS INC·Filed 1999·Granted Aug 29, 2000·257 cites·17 claims
- 0293US8945414B1Oxide removal by remote plasma treatment with fluorine and oxygen radicalsINTERMOLECULAR INC·Filed 2013·Granted Feb 3, 2015·93 cites·20 claims
- 0389US6149784ASputtering chamber shield promoting reliable plasma ignitionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 21, 2000·66 cites·25 claims
- 0477US9297775B2Combinatorial screening of metallic diffusion barriersINTERMOLECULAR INC·Filed 2014·Granted Mar 29, 2016·1 cites·20 claims
- 0577US6313042B1Cleaning contact with successive fluorine and hydrogen plasmasAPPLIED MATERIALS INC·Filed 1999·Granted Nov 6, 2001·56 cites·20 claims
- 0675US9337030B2Method to grow in-situ crystalline IGZO using co-sputtering targetsINTERMOLECULAR INC·Filed 2014·Granted May 10, 2016·3 cites·17 claims
- 0765US9023438B2Methods and apparatus for combinatorial PECVD or PEALDINTERMOLECULAR INC·Filed 2012·Granted May 5, 2015·0 cites·20 claims
- 0864US2025297352A1Oxide buffer layer to promote ti02 crystallinity and increase ti02 refractive index for optical applicationsINTERMOLECULAR INC·Filed 2023·Application pending·0 cites
- 0959US8854067B2Circular transmission line methods compatible with combinatorial processing of semiconductorsJOSHI AMOL·Filed 2012·Granted Oct 7, 2014·1 cites·12 claims
- 1058US2015184298A1Methods and Apparatus for Combinatorial PECVD or PEALDINTERMOLECULAR INC·Filed 2015·Application pending·0 cites
- 1152US2014183036A1In Situ Sputtering Target MeasurementINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
- 1251US2014174918A1Sputter GunINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
- 1351US2014134849A1Combinatorial Site Isolated Plasma Assisted DepositionINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
- 1446US2013168231A1Method For Sputter Deposition And RF Plasma Sputter Etch Combinatorial ProcessingYang hong sheng·Filed 2011·Application pending·0 cites
- 1538US6383915B1Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnectAPPLIED MATERIALS INC·Filed 1999·Granted May 7, 2002·8 cites·48 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →