Inventor · disambiguated record
Jianshe Tang
Also filed as: TANG JIANSHE
52 granted patents·60 pending applications·424 citations·filing 1997–2025
98Inventor score
Top patents by PatentIndex Score
112 records- 0198US10478937B2Acoustic emission monitoring and endpoint for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2015·Granted Nov 19, 2019·21 cites·10 claims
- 0297US11446711B2Steam treatment stations for chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2020·Granted Sep 20, 2022·8 cites·11 claims
- 0395US11633833B2Use of steam for pre-heating of CMP componentsAPPLIED MATERIALS INC·Filed 2020·Granted Apr 25, 2023·3 cites·20 claims
- 0492US7513062B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2005·Granted Apr 7, 2009·23 cites·13 claims
- 0591US11951589B2Wafer edge asymmetry correction using groove in polishing padAPPLIED MATERIALS INC·Filed 2020·Granted Apr 9, 2024·2 cites·19 claims
- 0690US6345630B2Method and apparatus for cleaning the edge of a thin discAPPLIED MATERIALS INC·Filed 2000·Granted Feb 12, 2002·43 cites·16 claims
- 0789US6955516B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2002·Granted Oct 18, 2005·33 cites·20 claims
- 0888US12318882B2Apparatus and method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2023·Granted Jun 3, 2025·0 cites·9 claims
- 0988US6855043B1Carrier head with a modified flexible membraneAPPLIED MATERIALS INC·Filed 2000·Granted Feb 15, 2005·33 cites·4 claims
- 1087US7980255B2Single wafer dryer and drying methodsAPPLIED MATERIALS INC·Filed 2007·Granted Jul 19, 2011·10 cites·18 claims
- 1185US12459011B2Steam treatment stations for chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2024·Granted Nov 4, 2025·0 cites·14 claims
- 1285US6202658B1Method and apparatus for cleaning the edge of a thin discAPPLIED MATERIALS INC·Filed 1998·Granted Mar 20, 2001·66 cites·16 claims
- 1384US7052365B2Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatusUNIV CALIFORNIA·Filed 2005·Granted May 30, 2006·9 cites·28 claims
- 1484US2024025006A1Temperature and slurry flow rate control in cmpAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1583US12296427B2Apparatus and method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2020·Granted May 13, 2025·1 cites·12 claims
- 1683US12285838B2Wafer edge asymmetry correction using groove in polishing padAPPLIED MATERIALS INC·Filed 2023·Granted Apr 29, 2025·0 cites·15 claims
- 1783US11728185B2Steam-assisted single substrate cleaning process and apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 1883US11077536B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Aug 3, 2021·2 cites·8 claims
- 1983US2025269486A1Apparatus and method for cmp temperature controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2082US11897079B2Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperityAPPLIED MATERIALS INC·Filed 2020·Granted Feb 13, 2024·1 cites·18 claims
- 2182US10967483B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Apr 6, 2021·2 cites·17 claims
- 2282US2025326086A1In-situ conditioner disk cleaning during cmpAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2381US12459078B2In-situ conditioner disk cleaning during CMPAPPLIED MATERIALS INC·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 2481US11597052B2Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·2 cites·17 claims
- 2580US11986926B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Granted May 21, 2024·0 cites·18 claims
- 2679US12434347B2Method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2023·Granted Oct 7, 2025·0 cites·13 claims
- 2779USD661718SNetwork cameraTANG JIANSHE·Filed 2011·Granted Jun 12, 2012·28 cites·1 claims
- 2879US2023029290A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2978US12030093B2Steam treatment stations for chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2022·Granted Jul 9, 2024·0 cites·15 claims
- 3078US11075165B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·2 cites·18 claims
- 3177US12106976B2Steam-assisted single substrate cleaning process and apparatusAPPLIED MATERIALS INC·Filed 2023·Granted Oct 1, 2024·0 cites·19 claims
- 3277US10350723B2Overpolishing based on electromagnetic inductive monitoring of trench depthAPPLIED MATERIALS INC·Filed 2017·Granted Jul 16, 2019·1 cites·20 claims
- 3376US2025205847A1Method for cmp temperature controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3475US12400881B2Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaningAPPLIED MATERIALS INC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 3575US12290896B2Apparatus and method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2020·Granted May 6, 2025·0 cites·12 claims
- 3675US11826872B2Temperature and slurry flow rate control in CMPAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·23 claims
- 3775US2025108476A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3875US2023256562A1Use of steam for pre-heating of cmp componentsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3974US11806835B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 4074US11298794B2Chemical mechanical polishing using time share controlAPPLIED MATERIALS INC·Filed 2019·Granted Apr 12, 2022·1 cites·14 claims
- 4174US7718009B2Cleaning submicron structures on a semiconductor wafer surfaceAPPLIED MATERIALS INC·Filed 2004·Granted May 18, 2010·18 cites·19 claims
- 4273US2021331288A1Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 4372US2024269796A1Index polishing for process control signal and wafer uniformityAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4472US2024066660A1Low-temperature metal cmp for minimizing dishing and corrosion, and improving pad asperityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4571US11697187B2Temperature-based assymetry correction during CMP and nozzle for media dispensingAPPLIED MATERIALS INC·Filed 2020·Granted Jul 11, 2023·0 cites·14 claims
- 4671US2023356351A1Chemical mechanical polishing temperature scanning apparatus for temperature controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4771US2024342855A1Steam generation for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4870US2024253183A1Apparatus and method for controlling substrate polish edge uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4970US2025114910A1High speed injection nozzle for pre-polish modification of substrate thicknessAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 5069US2025114908A1High performance cmp multidisk apparatusAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 112 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →