Apparatus and method for cmp temperature control

Abstract

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.

What is claimed is: 
     
         1 . A chemical mechanical polishing apparatus comprising:
 a platen to hold a polishing pad;   a motor to rotate the platen;   a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;   a polishing liquid dispenser having a first port positioned over the platen to deliver polishing liquid onto a first region of the polishing pad;   a rinse system having a second port positioned over the platen to deliver a rinsing liquid to a different second region of the polishing pad to clean the polishing pad; and   a temperature control system including a temperature control arm extending over the platen, a source of coolant fluid, and a plurality of nozzles positioned on the temperature control arm over the platen and coupled to the source of coolant fluid to deliver coolant fluid in a spray onto a different third region of the polishing pad, wherein the plurality of nozzles are oriented such that in operation a central axis of the spray is at an oblique relative to a polishing surface of the polishing pad and has a horizontal component in a direction opposite to a direction of motion of the platen in the third region.   
     
     
         2 . The apparatus of  claim 1 , wherein the coolant fluid comprises a liquid. 
     
     
         3 . The apparatus of  claim 2 , wherein the coolant fluid comprises water. 
     
     
         4 . The apparatus of  claim 1 , wherein the plurality of nozzles are configured to generate an aerosolized spray. 
     
     
         5 . The apparatus of  claim 1 , wherein the nozzles are disposed such that the coolant fluid is dispensed in zones that overlap along a radial axis of the platen. 
     
     
         6 . The apparatus of  claim 1 , wherein the second region is located between the carrier head and the third region along a direction of rotation of the platen. 
     
     
         7 . The apparatus of  claim 1 , comprising a temperature sensor and a controller configured to receive temperature measurements from the temperature sensor and to control the temperature control system to drive the polishing pad to a desired temperature. 
     
     
         8 . The apparatus of  claim 1 , wherein openings of the plurality of nozzles are positioned to be separated from the polishing pad by a gap of 0.5 to 5 mm. 
     
     
         9 . A chemical mechanical polishing apparatus comprising:
 a platen to hold a polishing pad;   a motor to rotate the platen;   a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;   a polishing liquid dispenser having a first port positioned over the platen to deliver polishing liquid onto a first region of the polishing pad;   a rinse system having a second port positioned over the platen to deliver a rinsing liquid to a different second region of the polishing pad to clean the polishing pad; and   a temperature control system including a temperature control arm extending over the platen, a source of coolant fluid, and a plurality of nozzles positioned on the temperature control arm over the platen and coupled to the source of coolant fluid to deliver coolant fluid in a spray onto a different third region of the polishing pad, wherein each nozzle of the plurality of nozzles is shaped such the spray impinges the polishing pad along an elongated region that extends parallel to the temperature control and overlaps along a radial axis of the platen.   
     
     
         10 . The apparatus of  claim 9 , wherein the plurality of nozzles are configured to generate a spray in a generally planar triangular volume. 
     
     
         11 . The apparatus of  claim 9 , wherein the coolant fluid comprises a liquid. 
     
     
         12 . The apparatus of  claim 11 , wherein the coolant fluid comprises water. 
     
     
         13 . The apparatus of  claim 9 , wherein the plurality of nozzles are configured to generate an aerosolized spray. 
     
     
         14 . The apparatus of  claim 9 , wherein the second region is located between the carrier head and the third region along a direction of rotation of the platen. 
     
     
         15 . The apparatus of  claim 9 , comprising a temperature sensor and a controller configured to receive temperature measurements from the temperature sensor and to control the temperature control system to drive the polishing pad to a desired temperature. 
     
     
         16 . The apparatus of  claim 9 , wherein openings of the plurality of nozzles are positioned to be separated from the polishing pad by a gap of 0.5 to 5 mm.