Inventor · disambiguated record
Haosheng Wu
Also filed as: WU HAOSHENG
29 granted patents·35 pending applications·22 citations·filing 2016–2025
94Inventor score
Top patents by PatentIndex Score
64 records- 0197US11446711B2Steam treatment stations for chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2020·Granted Sep 20, 2022·8 cites·11 claims
- 0295US11633833B2Use of steam for pre-heating of CMP componentsAPPLIED MATERIALS INC·Filed 2020·Granted Apr 25, 2023·3 cites·20 claims
- 0388US12403561B2Eddy current monitoring to detect vibration in polishingAPPLIED MATERIALS INC·Filed 2022·Granted Sep 2, 2025·1 cites·5 claims
- 0488US12318882B2Apparatus and method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2023·Granted Jun 3, 2025·0 cites·9 claims
- 0585US12459011B2Steam treatment stations for chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2024·Granted Nov 4, 2025·0 cites·14 claims
- 0684US2024025006A1Temperature and slurry flow rate control in cmpAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0783US12296427B2Apparatus and method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2020·Granted May 13, 2025·1 cites·12 claims
- 0883US11728185B2Steam-assisted single substrate cleaning process and apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 0983US11077536B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Aug 3, 2021·2 cites·8 claims
- 1083US2025269486A1Apparatus and method for cmp temperature controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1182US11897079B2Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperityAPPLIED MATERIALS INC·Filed 2020·Granted Feb 13, 2024·1 cites·18 claims
- 1282US10967483B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Apr 6, 2021·2 cites·17 claims
- 1382US2025326086A1In-situ conditioner disk cleaning during cmpAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1481US12459078B2In-situ conditioner disk cleaning during CMPAPPLIED MATERIALS INC·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 1581US11597052B2Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·2 cites·17 claims
- 1681US2023415297A1Control of steam generation for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1780US11986926B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Granted May 21, 2024·0 cites·18 claims
- 1879US12434347B2Method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2023·Granted Oct 7, 2025·0 cites·13 claims
- 1979US2025326084A1Eddy current monitoring to detect vibration in polishingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2079US2023029290A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2178US12030093B2Steam treatment stations for chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2022·Granted Jul 9, 2024·0 cites·15 claims
- 2277US12106976B2Steam-assisted single substrate cleaning process and apparatusAPPLIED MATERIALS INC·Filed 2023·Granted Oct 1, 2024·0 cites·19 claims
- 2376US2025205847A1Method for cmp temperature controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2475US12290896B2Apparatus and method for CMP temperature controlAPPLIED MATERIALS INC·Filed 2020·Granted May 6, 2025·0 cites·12 claims
- 2575US11826872B2Temperature and slurry flow rate control in CMPAPPLIED MATERIALS INC·Filed 2021·Granted Nov 28, 2023·0 cites·23 claims
- 2675US2025108476A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2775US2023256562A1Use of steam for pre-heating of cmp componentsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2874US11806835B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 2973US2021331288A1Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3072US12290897B2Fluid-tight electrical connection techniques for semiconductor processingAPPLIED MATERIALS INC·Filed 2022·Granted May 6, 2025·0 cites·18 claims
- 3172US11833637B2Control of steam generation for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 3272US2024066660A1Low-temperature metal cmp for minimizing dishing and corrosion, and improving pad asperityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3371US12472604B2Grounding techniques for ESD polymeric fluid linesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 18, 2025·0 cites·19 claims
- 3471US11697187B2Temperature-based assymetry correction during CMP and nozzle for media dispensingAPPLIED MATERIALS INC·Filed 2020·Granted Jul 11, 2023·0 cites·14 claims
- 3571US2023356351A1Chemical mechanical polishing temperature scanning apparatus for temperature controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3671US2024342855A1Steam generation for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3770US2024253183A1Apparatus and method for controlling substrate polish edge uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3870US2025114910A1High speed injection nozzle for pre-polish modification of substrate thicknessAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3969US2023249225A1Steam cleaning of cmp componentsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4068US2025262714A1Generation of background signal sequence using an in-situ monitoring system in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4168US2025153303A1Substrate hot spot correction for a chemical mechanical polishing processsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4268US2024408650A1Method and apparatus to clean substrate with atomizing nozzleAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4368US2025114903A1Retaining-ring-less cmp processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4467US2024139900A1Acoustic carrier head monitoringAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4566US2024042570A1Cleaning of cmp temperature control systemAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4665US12392427B2Insulated fluid lines in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Granted Aug 19, 2025·0 cites·14 claims
- 4765US11752589B2Chemical mechanical polishing temperature scanning apparatus for temperature controlAPPLIED MATERIALS INC·Filed 2020·Granted Sep 12, 2023·0 cites·19 claims
- 4865US2025114909A1Cold liquid polishing controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4965US2024326198A1Compact adjustable spray nozzle to precisely target areas for rinsing, removing particles, and improve hardware cleanlinessAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 5064US11628478B2Steam cleaning of CMP componentsAPPLIED MATERIALS INC·Filed 2020·Granted Apr 18, 2023·0 cites·10 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →