Steam cleaning of cmp components

Abstract

A chemical mechanical polishing system includes a platen to support a polishing pad, a boiler, a component that is movable between a first position spaced from the polishing pad and a second position in contact with the polishing pad, a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when located at the first position, an actuator to move the component from the first position to the second position in contact with the polishing pad, and a controller configured to cause the treatment station to direct the steam onto the component to clean the component, and cause the actuator to move the cleaned component from the treatment station into contact with the polishing pad.

What is claimed is: 
     
         1 . A chemical mechanical polishing system, comprising:
 a platen to support a polishing pad;   a boiler;   a component that is movable between a first position spaced from the polishing pad and a second position in contact with the polishing pad;   a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when located at the first position;   an actuator to move the component from the first position to the second position in contact with the polishing pad; and   a controller configured to
 cause the treatment station to direct the steam onto the component to clean the component, and 
 cause the actuator to move the cleaned component from the treatment station into contact with the polishing pad. 
   
     
     
         2 . The system of  claim 1 , wherein the component comprises a carrier head. 
     
     
         3 . The system of  claim 2 , comprising a substrate transfer station, and wherein the first position is in the substrate transfer station. 
     
     
         4 . The system of  claim 2 , comprising an inter-platen station, and wherein the first position is in the inter-platen station. 
     
     
         5 . The system of  claim 1 , wherein the component comprises a conditioner disk or conditioner head. 
     
     
         6 . The system of  claim 5 , comprising a conditioner disk cleaning cup, and wherein the first position is in the conditioner disk cleaning cup. 
     
     
         7 . The system of  claim 1 , comprising a motor and a drive shaft to rotate the component, and wherein the controller is configured cause the motor and drive shaft to rotate the component as steam is directed onto the component. 
     
     
         8 . The system of  claim 1 , comprising a motor and a support shaft to vertically shift the component, and wherein the controller is configured cause the motor and support shaft to vertically shift the component as steam is directed onto the component. 
     
     
         9 . The system of  claim 1 , wherein the controller is configured to set a timer and to halt directing of the steam at expiration of the timer. 
     
     
         10 . The system of  claim 1 , wherein the controller is configured to control the boiler such that the steam has a temperature of 70-100° C. 
     
     
         11 . The system of  claim 10 , wherein the controller is configured to control the boiler such that the steam has a temperature of 80-100° C. 
     
     
         12 . The system of  claim 1 , wherein the boiler is configured to provide dry steam. 
     
     
         13 . The system of  claim 1 , wherein the boiler is configured to provide gas that consists of steam. 
     
     
         14 . The system of  claim 1 , wherein the boiler is configured to provide gas that comprises a mixture of steam and atmosphere.