Inventor · disambiguated record
Jiunheng Wang
Also filed as: WANG JIUNHENG
3 granted patents·3 pending applications·18 citations·filing 2005–2007
62Inventor score
Top patents by PatentIndex Score
6 records- 0178US7170160B1Chip structure and stacked-chip packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Jan 30, 2007·14 cites·13 claims
- 0261US7586200B2Light emitting diode chip with reflective layer thereonCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Sep 8, 2009·4 cites·5 claims
- 0338US2007228406A1Chip package structure and method for manufacturing bumpsWANG JIUNHENG·Filed 2007·Application pending·0 cites
- 0436US7538435B2Wafer structure and bumping processCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted May 26, 2009·0 cites·10 claims
- 0536US2007048997A1Chip package structure and method for manufacturing bumpsWANG JIUNHENG·Filed 2005·Application pending·0 cites
- 0629US2007057998A1Nozzle plate and manufacturing process thereofWANG JIUNHENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →