Inventor · disambiguated record
Jimin Wen
Also filed as: WEN JIMIN
10 granted patents·2 pending applications·16 citations·filing 2013–2025
84Inventor score
Top patents by PatentIndex Score
12 records- 0191US11797744B1Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learningANSYS INC·Filed 2021·Granted Oct 24, 2023·3 cites·12 claims
- 0289US11880456B1Adaptive leakage impact region detection and modeling for counterfeit chips detectionANSYS INC·Filed 2021·Granted Jan 23, 2024·2 cites·20 claims
- 0386US11853661B2Systems and methods for machine learning based fast static thermal solverANSYS INC·Filed 2022·Granted Dec 26, 2023·1 cites·14 claims
- 0483US12177349B1Machine learning for automatic identification of points of interest for side channel leakageANSYS INC·Filed 2021·Granted Dec 24, 2024·1 cites·21 claims
- 0580US11366947B2Systems and methods for machine learning based fast static thermal solverANSYS INC·Filed 2019·Granted Jun 21, 2022·2 cites·12 claims
- 0677US12242781B2Systems and methods for machine learning based fast static thermal solverANSYS INC·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 0777US2025088358A1Machine learning for automatic identification of points of interest for side channel leakageANSYS INC·Filed 2024·Application pending·0 cites
- 0875US11914931B2Predicting on chip transient thermal response in a multi-chip system using an RNN-based predictorANSYS INC·Filed 2019·Granted Feb 27, 2024·3 cites·29 claims
- 0974US9805151B1Method and apparatus for Laplace transform system simulationCADENCE DESIGN SYSTEMS INC·Filed 2013·Granted Oct 31, 2017·4 cites·23 claims
- 1073US2025173487A1Systems and methods for machine learning based fast static thermal solverANSYS INC·Filed 2025·Application pending·0 cites
- 1172US12393686B2Adaptive leakage impact region detection and modeling for counterfeit chips detectionANSYS INC·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1272US12307184B1Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learningANSYS INC·Filed 2023·Granted May 20, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →