Inventor · disambiguated record
Jianwen Xu
Also filed as: XU JIANWEN
22 granted patents·8 pending applications·182 citations·filing 2002–2025
94Inventor score
Top patents by PatentIndex Score
30 records- 0196US7595226B2Method of packaging an integrated circuit dieFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·65 cites·20 claims
- 0294US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0391US8617935B2Back side alignment structure and manufacturing method for three-dimensional semiconductor device packagesXU JIANWEN·Filed 2011·Granted Dec 31, 2013·14 cites·20 claims
- 0491US8597630B2Thermal-responsive polymer networks, compositions, and methods and applications related theretoSONG JIE·Filed 2010·Granted Dec 3, 2013·6 cites·9 claims
- 0590US8609471B2Packaging an integrated circuit die using compression moldingXU JIANWEN·Filed 2008·Granted Dec 17, 2013·21 cites·17 claims
- 0689US6864306B2High dielectric polymer composites and methods of preparation thereofGEORGIA TECH RES INST·Filed 2002·Granted Mar 8, 2005·27 cites·27 claims
- 0787US9388276B2Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogelsSONG JIE·Filed 2012·Granted Jul 12, 2016·3 cites·2 claims
- 0883US12218041B2Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methodsQUALCOMM INC·Filed 2021·Granted Feb 4, 2025·1 cites·20 claims
- 0983US9259509B2Thermal responsive polymer siloxanes, compositions, and method and applications related theretoUNIV MASSACHUSETTS MEDICAL·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
- 1082US8327532B2Method for releasing a microelectronic assembly from a carrier substrateXU JIANWEN·Filed 2009·Granted Dec 11, 2012·8 cites·18 claims
- 1180US12502352B1Formulations of anti-interleukin 1 receptor 1 antibodiesKINIKSA PHARMACEUTICALS GMBH·Filed 2025·Granted Dec 23, 2025·0 cites·29 claims
- 1276US8765112B2Thermal responsive polymer siloxanes, compositions, and method and applications related theretoSONG JIE·Filed 2008·Granted Jul 1, 2014·2 cites·17 claims
- 1376US2025118645A1Integrated circuit (ic) packages employing a capacitor-embedded, redistribution layer (rdl) substrate for interfacing an ic chip(s) to a package substrate, and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1470US10752614B2Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and peg-co-polycarbonate hydrogelsUNIV MASSACHUSETTS MEDICAL SCHOOL·Filed 2018·Granted Aug 25, 2020·0 cites·21 claims
- 1569US2025388686A1Compositions of il-1r1 antibodies and methods of producing and using the sameKINIKSA PHARMACEUTICALS GMBH·Filed 2025·Application pending·0 cites
- 1666US10141202B2Semiconductor device comprising mold for top side and sidewall protectionQUALCOMM INC·Filed 2013·Granted Nov 27, 2018·2 cites·21 claims
- 1764US9318405B2Wafer level package without sidewall crackingQUALCOMM INC·Filed 2015·Granted Apr 19, 2016·1 cites·20 claims
- 1863US8841168B2Soldering relief method and semiconductor device employing sameQUALCOMM INC·Filed 2013·Granted Sep 23, 2014·2 cites·19 claims
- 1962US8236609B2Packaging an integrated circuit die with backside metallizationRAMANATHAN LAKSHMI N·Filed 2008·Granted Aug 7, 2012·3 cites·16 claims
- 2062US2010098761A1Polymer Compositions For Biomedical And Material ApplicationsUNIV MASSACHUSETTS MEDICAL·Filed 2008·Application pending·0 cites
- 2161US9908871B2Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogelsUNIV MASSACHUSETTS MEDICAL SCHOOL·Filed 2016·Granted Mar 6, 2018·0 cites·8 claims
- 2261US2014357806A1Thermal-responsive polymer networks, compositions, and methods and applications related theretoUNIV MASSACHUSETTS MEDICAL·Filed 2013·Application pending·0 cites
- 2357US2025357448A1Package comprising a passive device with a front side protection layerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2454US2024071993A1Package comprising a chiplet located between two metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2554US2024072032A1Package comprising a chiplet located between an integrated device and a metallization portionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 2650US11784157B2Package comprising integrated devices coupled through a metallization layerQUALCOMM INC·Filed 2021·Granted Oct 10, 2023·0 cites·33 claims
- 2744US9034697B2Apparatus and methods for quad flat no lead packagingGONG ZHIWEI·Filed 2011·Granted May 19, 2015·0 cites·10 claims
- 2842US9054111B2Electronic device and method of packaging an electronic deviceXU JIANWEN·Filed 2009·Granted Jun 9, 2015·0 cites·25 claims
- 2941US2017182220A1Degradable hydrogel with predictable tuning of properties, and compositions and methods thereofUNIV MASSACHUSETTS·Filed 2015·Application pending·0 cites
- 3037US8461676B2Soldering relief method and semiconductor device employing sameSCHWARZ MARK WENDELL·Filed 2011·Granted Jun 11, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →