Inventor · disambiguated record
Johyun Bae
Also filed as: BAE JOHYUN
23 granted patents·2 pending applications·413 citations·filing 2006–2014
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
25 records- 0198US8304900B2Integrated circuit packaging system with stacked lead and method of manufacture thereofJANG KI YOUN·Filed 2010·Granted Nov 6, 2012·120 cites·20 claims
- 0298US8232141B2Integrated circuit packaging system with conductive pillars and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Jul 31, 2012·114 cites·11 claims
- 0397US7923304B2Integrated circuit packaging system with conductive pillars and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 12, 2011·61 cites·4 claims
- 0493US9330945B2Integrated circuit package system with multi-chip moduleSONG SUNGMIN·Filed 2007·Granted May 3, 2016·33 cites·14 claims
- 0592US7800212B2Mountable integrated circuit package system with stacking interposerSTATS CHIPPAC LTD·Filed 2007·Granted Sep 21, 2010·24 cites·18 claims
- 0690US7687897B2Mountable integrated circuit package-in-package system with adhesive spacing structuresSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·19 cites·20 claims
- 0785US8674516B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofHAN BYUNG JOON·Filed 2011·Granted Mar 18, 2014·8 cites·18 claims
- 0883US8698297B2Integrated circuit packaging system with stack deviceBAE JOHYUN·Filed 2011·Granted Apr 15, 2014·6 cites·4 claims
- 0981US8569869B2Integrated circuit packaging system with encapsulation and method of manufacture thereofPARK HYUNGSANG·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 1081US8497575B2Semiconductor packaging system with an aligned interconnect and method of manufacture thereofYOON IN SANG·Filed 2010·Granted Jul 30, 2013·6 cites·20 claims
- 1169US8772916B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2012·Granted Jul 8, 2014·2 cites·5 claims
- 1267US8252615B2Integrated circuit package system employing mold flash prevention technologyJANG KI YOUN·Filed 2006·Granted Aug 28, 2012·3 cites·10 claims
- 1364US9093392B2Integrated circuit packaging system with vertical interconnection and method of manufacture thereofCHO SUNGWON·Filed 2010·Granted Jul 28, 2015·2 cites·20 claims
- 1463US8039275B1Integrated circuit packaging system with rounded interconnect and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Oct 18, 2011·1 cites·10 claims
- 1563US7710735B2Multichip package systemSTATS CHIPPAC LTD·Filed 2006·Granted May 4, 2010·2 cites·20 claims
- 1662US8501535B2Integrated circuit package system with dual side connection and method for manufacturing thereofSONG SUNGMIN·Filed 2011·Granted Aug 6, 2013·1 cites·18 claims
- 1759US8699232B2Integrated circuit packaging system with interposer and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Apr 15, 2014·1 cites·9 claims
- 1857US8643181B2Integrated circuit packaging system with encapsulation and method of manufacture thereofBAE JOHYUN·Filed 2010·Granted Feb 4, 2014·1 cites·20 claims
- 1956US9093391B2Integrated circuit packaging system with fan-in package and method of manufacture thereofAHN SEUNGYUN·Filed 2009·Granted Jul 28, 2015·2 cites·20 claims
- 2053US9349666B1Integrated circuit packaging system with package stackingBAE JOHYUN·Filed 2014·Granted May 24, 2016·0 cites·6 claims
- 2150US7884457B2Integrated circuit package system with dual side connectionSTATS CHIPPAC LTD·Filed 2007·Granted Feb 8, 2011·0 cites·7 claims
- 2249US8461680B2Integrated circuit packaging system with rounded interconnectBAE JOHYUN·Filed 2011·Granted Jun 11, 2013·0 cites·16 claims
- 2345US8129832B2Mountable integrated circuit package system with substrate having a conductor-free recessCARSON FLYNN·Filed 2007·Granted Mar 6, 2012·0 cites·18 claims
- 2439US2007268660A1Spacerless semiconductor package chip stacking systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 2538US2009283889A1Integrated circuit package systemJANG BYOUNG WOOK·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →