Inventor · disambiguated record
John Briar
Also filed as: BRIAR JOHN · BRIAR JOHN R
20 granted patents·4 pending applications·856 citations·filing 1994–2016
96Inventor score
Files withST ASSEMBLY TEST SERVICES PTE10ST ASSEMBLY TEST SERVICES LTD4AMKOR TECHNOLOGY INC3ST ASSEMBLY TEST SERVICE LTD3ADVANPACK SOLUTIONS PTE LTD2
Top patents by PatentIndex Score
24 records- 0195US6329606B1Grid array assembly of circuit boards with singulation groovesAMKOR TECHNOLOGY INC·Filed 1998·Granted Dec 11, 2001·269 cites·11 claims
- 0290US6432742B1Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packagesST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Aug 13, 2002·90 cites·31 claims
- 0389US5635671AMold runner removal from a substrate-based packaged electronic deviceAMKOR TECHNOLOGY INC·Filed 1994·Granted Jun 3, 1997·109 cites·17 claims
- 0487US6544812B1Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Apr 8, 2003·45 cites·12 claims
- 0587US6479903B2Flip chip thermally enhanced ball grid arrayST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Nov 12, 2002·42 cites·8 claims
- 0685US6750082B2Method of assembling a package with an exposed die backside with and without a heatsink for flip-chipADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Jun 15, 2004·45 cites·58 claims
- 0783US6255143B1Flip chip thermally enhanced ball grid arrayST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Jul 3, 2001·62 cites·11 claims
- 0877US5852870AMethod of making grid array assemblyAMKOR TECHNOLOGY INC·Filed 1996·Granted Dec 29, 1998·51 cites·12 claims
- 0973US6537857B2Enhanced BGA grounded heatsinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Mar 25, 2003·18 cites·11 claims
- 1070US6355199B1Method of molding flexible circuit with molded stiffenerST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Mar 12, 2002·35 cites·17 claims
- 1163US6660565B1Flip chip molded/exposed die process and package structureST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Dec 9, 2003·10 cites·12 claims
- 1261US6168975B1Method of forming extended lead packageST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Jan 2, 2001·24 cites·10 claims
- 1360US6759752B2Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jul 6, 2004·8 cites·12 claims
- 1457US6617525B2Molded stiffener for flexible circuit moldingST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Sep 9, 2003·6 cites·6 claims
- 1555US6372553B1Disposable mold runner gate for substrate based electronic packagesST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Apr 16, 2002·18 cites·10 claims
- 1653US6828671B2Enhanced BGA grounded heatsinkST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Dec 7, 2004·5 cites·22 claims
- 1750US7081668B2Flip chip molded/exposed die process and package structureST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Jul 25, 2006·3 cites·13 claims
- 1850US6543127B1Coplanarity inspection at the singulation processST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Apr 8, 2003·3 cites·14 claims
- 1946US6103550AMolded tape support for a molded circuit package prior to dicingST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Aug 15, 2000·13 cites·18 claims
- 2042US2017178193A1Methods and systems of a sponsored mobile data usage platformTUBE INCORPORATED·Filed 2016·Application pending·0 cites
- 2139US6770962B2Disposable mold runner gate for substrate based electronic packagesST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Aug 3, 2004·0 cites·8 claims
- 2238US2001002320A1Extended lead packageST ASSEMBLY TEST SERVICES PTE·Filed 2000·Application pending·0 cites
- 2337US2004173424A1Internal damper valving filterDELPHI TECH INC·Filed 2003·Application pending·0 cites
- 2434US2004084508A1Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assemblyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →