Inventor · disambiguated record
Joseph V. Cesna
Also filed as: CESNA JOSEPH · CESNA JOSEPH V
21 granted patents·1,004 citations·filing 1979–1999
97Inventor score
Top patents by PatentIndex Score
21 records- 0198US4519168ALiquid waxless fixturing of microsize wafersSPEEDFAM CORP·Filed 1983·Granted May 28, 1985·80 cites·5 claims
- 0297US5486131ADevice for conditioning polishing padsSPEEDFAM CORP·Filed 1994·Granted Jan 23, 1996·212 cites·10 claims
- 0395US4270314ABearing mount for lapping machine pressure plateSPEEDFAM CORP·Filed 1979·Granted Jun 2, 1981·43 cites·6 claims
- 0494US6238271B1Methods and apparatus for improved polishing of workpiecesSPEED FAM IPEC CORP·Filed 1999·Granted May 29, 2001·183 cites·24 claims
- 0582US5595529ADual column abrading machineSPEEDFAM CORP·Filed 1994·Granted Jan 21, 1997·36 cites·15 claims
- 0681US5868605AIn-situ polishing pad flatness controlSPEEDFAM CORP·Filed 1995·Granted Feb 9, 1999·53 cites·6 claims
- 0780US6089961AWafer polishing carrier and ring extension thereforSPEEDFAM IPEC CORP·Filed 1998·Granted Jul 18, 2000·48 cites·11 claims
- 0879US5791975ABacking padSPEEDFAM CORP·Filed 1995·Granted Aug 11, 1998·46 cites·2 claims
- 0978US4593716AControl valve assembly for abrasive slurrySPEEDFAM CORP·Filed 1980·Granted Jun 10, 1986·18 cites·3 claims
- 1077US5972162AWafer polishing with improved end point detectionSPEEDFAM CORP·Filed 1998·Granted Oct 26, 1999·41 cites·18 claims
- 1173US5224304AAutomated free abrasive machine for one side piece part machiningSPEEDFAM CORP·Filed 1991·Granted Jul 6, 1993·27 cites·16 claims
- 1272US5951370AMethod and apparatus for monitoring and controlling the flatness of a polishing padSPEEDFAM IPEC CORP·Filed 1997·Granted Sep 14, 1999·33 cites·25 claims
- 1365US5782678ADual column abrading machineSPEEDFAM CORP·Filed 1996·Granted Jul 21, 1998·23 cites·9 claims
- 1465US4693012AMeasuring bar for free abrasive machinesSPEEDFAM CORP·Filed 1985·Granted Sep 15, 1987·21 cites·11 claims
- 1563US6142857AWafer polishing with improved backing arrangementSPEEDFAM IPEC CORP·Filed 1998·Granted Nov 7, 2000·23 cites·17 claims
- 1663US5993293AMethod and apparatus for improved semiconductor wafer polishingSPEEDFAM CORP·Filed 1998·Granted Nov 30, 1999·24 cites·14 claims
- 1762US5938506AMethods and apparatus for conditioning grinding stonesSPEEDFAM IPEC CORP·Filed 1997·Granted Aug 17, 1999·27 cites·20 claims
- 1861US6168683B1Apparatus and method for the face-up surface treatment of wafersSPEEDFAM IPEC CORP·Filed 1998·Granted Jan 2, 2001·21 cites·28 claims
- 1959US5803798ADual column abrading machineSPEEDFAM CORP·Filed 1997·Granted Sep 8, 1998·17 cites·8 claims
- 2048US6102779AMethod and apparatus for improved semiconductor wafer polishingSPEEDFAM IPEC INC·Filed 1998·Granted Aug 15, 2000·16 cites·14 claims
- 2148US5791978ABearing assembly for wafer planarization carrierSPEEDFAM CORP·Filed 1996·Granted Aug 11, 1998·12 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Joseph V. Cesna files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →