Inventor · disambiguated record
John Commander
Also filed as: COMMANDER JOHN · COMMANDER JOHN H
11 granted patents·4 pending applications·146 citations·filing 1990–2023
88Inventor score
Top patents by PatentIndex Score
15 records- 0191US5435898AAlkaline zinc and zinc alloy electroplating baths and processesENTHONE OMI INC·Filed 1994·Granted Jul 25, 1995·82 cites·23 claims
- 0281US7316772B2Defect reduction in electrodeposited copper for semiconductor applicationsENTHONE·Filed 2002·Granted Jan 8, 2008·23 cites·21 claims
- 0380US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 0477US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0570US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 0670US9222188B2Defect reduction in electrodeposited copper for semiconductor applicationsCOMMANDER JOHN·Filed 2008·Granted Dec 29, 2015·3 cites·10 claims
- 0769US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0866US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 0963US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 1062US5061351ABright tin electrodeposition compositionENTHONE OMI INC·Filed 1990·Granted Oct 29, 1991·15 cites·11 claims
- 1153US5578187APlating process for electroless nickel on zinc die castingsENTHONE OMI INC·Filed 1995·Granted Nov 26, 1996·20 cites·7 claims
- 1250US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 1348US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 1443US2016281251A1Electrodeposition of CopperENTHONE·Filed 2014·Application pending·0 cites
- 1536US2018355502A1Process for metalization of copper pillars in the manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →