Inventor · disambiguated record
John Hearne
Also filed as: HEARNE JOHN · HEARNE JOHN S
10 granted patents·1 pending application·1,051 citations·filing 1993–2006
93Inventor score
Top patents by PatentIndex Score
11 records- 0199US5884640AMethod and apparatus for drying substratesAPPLIED MATERIALS INC·Filed 1997·Granted Mar 23, 1999·535 cites·22 claims
- 0286US6348124B1Delivery of polishing agents in a wafer processing systemAPPLIED MATERIALS INC·Filed 1999·Granted Feb 19, 2002·89 cites·11 claims
- 0385US6701381B2Data processing system and development methodKIMONO LTD·Filed 2001·Granted Mar 2, 2004·92 cites·14 claims
- 0481US5566466ASpindle assembly with improved wafer holderONTRAK SYSTEMS INC·Filed 1994·Granted Oct 22, 1996·77 cites·22 claims
- 0581US5358760AProcess for producing solid bricks from fly ash, bottom ash, lime, gypsum, and calcium carbonateRICHHART EARL·Filed 1993·Granted Oct 25, 1994·50 cites·4 claims
- 0679US7086933B2Flexible polishing fluid delivery systemAPPLIED MATERIALS INC·Filed 2002·Granted Aug 8, 2006·21 cites·27 claims
- 0778US5745946ASubstrate processing systemONTRAK SYSTEMS INC·Filed 1996·Granted May 5, 1998·68 cites·17 claims
- 0877US6027574AMethod of drying a substrate by lowering a fluid surface levelAPPLIED MATERIALS INC·Filed 1998·Granted Feb 22, 2000·43 cites·42 claims
- 0973US5727332AContamination control in substrate processing systemONTRAK SYSTEMS INC·Filed 1997·Granted Mar 17, 1998·44 cites·17 claims
- 1063US6513848B1Hydraulically actuated wafer clampAPPLIED MATERIALS INC·Filed 1999·Granted Feb 4, 2003·32 cites·7 claims
- 1142US2006246821A1Method for controlling polishing fluid distributionVEREEN LIDIA·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →