Method for controlling polishing fluid distribution

Abstract

A method for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, a method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher includes flowing polishing fluid to a first portion of the polishing surface through a first outlet while a second portion of the polishing surface adjacent a second outlet receives no flow of polishing fluid, and flowing polishing fluid through the second outlet to the second portion of the polishing surface.

1 . A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising: 
 flowing polishing fluid to a first portion of the polishing surface through a first outlet while a second portion of the polishing surface adjacent a second outlet receives no flow of polishing fluid;    flowing polishing fluid through the second outlet to the second portion of the polishing surface; and    polishing a substrate on the first and second portions of the polishing surface in the presence of polishing fluid provided from the first and second outlets.    
   
   
       2 . The method of  claim 1  further comprising: 
 ceasing the flow of polishing fluid through the first outlet upon commencing flow through the second outlet.    
   
   
       3 . The method of  claim 1  further comprising: 
 continuing the flow of polishing fluid through the first outlet upon commencing flow through the second outlet.    
   
   
       4 . The method of  claim 1 , wherein the step of flowing polishing fluid through the second outlet to the second portion of the polishing surface further comprises flowing polishing fluid through second outlet at a rate equal to a rate of flow of polishing fluid through the first outlet.  
   
   
       5 . The method of  claim 4 , wherein the polishing fluid flows from the first and second outlets at the same time.  
   
   
       6 . The method of  claim 4 , wherein the polishing fluid flows from the first and second outlets at different times.  
   
   
       7 . The method of  claim 1 , wherein the step of flowing polishing fluid through the second outlet to the second portion of the polishing surface further comprises flowing polishing fluid through second outlet at a rate different than a rate of flow of polishing fluid through the first outlet.  
   
   
       8 . The method of  claim 7 , wherein the polishing fluid flows from the first and second outlets at the same time.  
   
   
       9 . The method of  claim 7 , wherein the polishing fluid flows from the first and second outlets at different times.  
   
   
       10 . The method of  claim 1 , wherein a position of the first outlet along the arm is adjustable relative to the second outlet.  
   
   
       11 . The method of  claim 1 , wherein the step of flowing polishing fluid through the second outlet to the second portion of the polishing surface further comprises: 
 sensing an indicia of polishing rate; and    commencing the flow of polishing fluid through the second outlet in response to the sensed indicia.    
   
   
       12 . The method of  claim 11 , wherein the step of sensing the indicia of polishing rate further comprises: 
 sensing at least one of thickness or topography of a surface being polished or polishing time.    
   
   
       13 . The method of  claim 1  further comprising delivering polishing fluid to the first and second outlets from a homogeneous source.  
   
   
       14 . The method of  claim 1  further comprising delivering polishing fluid having the same concentration to the first and second outlets.  
   
   
       15 . The method of  claim 1  further comprising delivering polishing fluid to different radial locations on the polishing surface.  
   
   
       16 . A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising: 
 flowing polishing fluid into a manifold coupled to a plurality of outlets disposed in a spaced-apart relation over the polishing surface;    allowing flow of polishing fluid through at least one of the outlets to the polishing surface while polishing a substrate; and    preventing flow of polishing fluid through at least one of the outlets while polishing the substrate.    
   
   
       17 . The method of  claim 16 , wherein at least one of the outlets having a condition characterized by flow or no flow of polishing fluid therethrough is changed to the opposite condition in-situ polishing the substrate.  
   
   
       18 . The method of  claim 16 , wherein the step of preventing further comprises: 
 sensing an indicia of polishing rate; and    preventing flow of polishing fluid through at least one of the outlets in response to the sensed indicia.    
   
   
       19 . A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising: 
 flowing polishing fluid to a first region of the polishing surface while polishing the substrate;    flowing polishing fluid to a second region of the polishing surface while polishing the substrate; and    discontinuing the flow of flowing polishing fluid to at least one of the first or second regions while polishing the substrate.    
   
   
       20 . The method of  claim 19 , wherein the step of discontinuing the flow of flowing polishing fluid further comprises: 
 sensing an indicia of polishing rate; and    discontinuing the flow of flowing polishing fluid from at least one of the regions in response to the sensed indicia.    
   
   
       21 . The method of  claim 19 , wherein the step of discontinuing the flow of flowing polishing fluid further comprises: 
 discontinuing the flow of flowing polishing fluid the first and second regions; and    flowing polishing fluid to a third region of the polishing surface while polishing the substrate.    
   
   
       22 . The method of  claim 19  further comprising: 
 delivering polishing fluid to the first and second regions from a homogeneous source.    
   
   
       23 . The method of  claim 19  further comprising: 
 delivering polishing fluid having the same concentration to the first and second regions.    
   
   
       24 . The method of  claim 19  further comprising: 
 delivering polishing fluid to the first and second regions from outlets feed from a single supply conduit.    
   
   
       25 . The method of  claim 19  further comprising: 
 delivering polishing fluid to the first and second regions at equal flow rates.    
   
   
       26 . The method of  claim 19  further comprising: 
 delivering polishing fluid to the first and second regions at different flow rates.    
   
   
       27 . A method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher, the method comprising: 
 flowing polishing fluid having the same concentration to different regions of the polishing surface while processing a substrate, wherein at least one of the regions has a condition characterized by receiving flow or no flow of polishing fluid from a first outlet of a plurality of polishing fluid delivery outlets positioned to deliver fluid to the regions; and    changing the condition of the first outlet to an opposite condition in-situ processing the substrate.    
   
   
       28 . The method of  claim 27 , wherein the step of changing further comprises: 
 sensing an indicia of polishing rate; and    changing the condition of the first outlet in response to the sensed indicia.