Inventor · disambiguated record
Christopher Heung-Gyun Lee
Also filed as: LEE CHRISTOPHER H · LEE CHRISTOPHER HEUNG-GYUN
10 granted patents·12 pending applications·88 citations·filing 2002–2025
87Inventor score
Top patents by PatentIndex Score
22 records- 0191US10350728B2System and process for in situ byproduct removal and platen cooling during CMPAPPLIED MATERIALS INC·Filed 2015·Granted Jul 16, 2019·9 cites·19 claims
- 0286US8439723B2Chemical mechanical polisher with heater and methodMARKS ROBERT A·Filed 2008·Granted May 14, 2013·21 cites·18 claims
- 0384US10322492B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·18 claims
- 0482US7063597B2Polishing processes for shallow trench isolation substratesAPPLIED MATERIALS INC·Filed 2003·Granted Jun 20, 2006·30 cites·14 claims
- 0579US7086933B2Flexible polishing fluid delivery systemAPPLIED MATERIALS INC·Filed 2002·Granted Aug 8, 2006·21 cites·27 claims
- 0675US9498866B2Polishing pad cleaning with vacuum apparatusAPPLIED MATERIALS INC·Filed 2014·Granted Nov 22, 2016·3 cites·13 claims
- 0775US2025375853A1Slurry-based temperature control for cmpAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0874US2022281070A1Slurry-based temperature control for cmpAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0974US2022281061A1Temperature control with intra-layer transition during cmpAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1068US2025114901A1Grooves for edge and hot spot compensation in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1168US2024042571A1Spray system for slurry reduction during chemical mechanical polishing (cmp)APPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1268US2025114898A1Retaining ring for edge compensation by slurry flow controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1368US2025114897A1Edge and hot spot compensation techniques in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1467US2024139906A1Control of carrier head sweep and platen shapeAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1563US11819976B2Spray system for slurry reduction during chemical mechanical polishing (cmp)APPLIED MATERIALS INC·Filed 2021·Granted Nov 21, 2023·0 cites·19 claims
- 1662US2024383099A1Multi head pad conditioning apparatus and method of useAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1760US11673226B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2019·Granted Jun 13, 2023·0 cites·20 claims
- 1860US2022388116A1Method of detecting chemical mechanical polishing conditioning disk orientationAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1959US8211325B2Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applicationsDIAO JIE·Filed 2010·Granted Jul 3, 2012·1 cites·20 claims
- 2055US11794305B2Platen surface modification and high-performance pad conditioning to improve CMP performanceAPPLIED MATERIALS INC·Filed 2020·Granted Oct 24, 2023·0 cites·17 claims
- 2142US2006246821A1Method for controlling polishing fluid distributionVEREEN LIDIA·Filed 2006·Application pending·0 cites
- 2239US2013189841A1Engineering dielectric films for cmp stopBALSEANU MIHAELA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →