Inventor · disambiguated record
John Heck
Also filed as: HECK JOHN · HECK JOHN A
3 granted patents·18 pending applications·79 citations·filing 1990–2022
66Inventor score
Top patents by PatentIndex Score
21 records- 0183US5066026AGas face sealKAYDON CORP·Filed 1990·Granted Nov 19, 1991·77 cites·20 claims
- 0264US8487386B2Method for forming MEMS devices having low contact resistance and devices obtained thereofJAIN AJAY·Filed 2010·Granted Jul 16, 2013·1 cites·19 claims
- 0357US2009294028A1Process for fabricating high density storage device with high-temperature mediaNANOCHIP INC·Filed 2008·Application pending·0 cites
- 0453US2024103216A1Vertical through-silicon waveguide fabrication method and topologiesINTEL CORP·Filed 2022·Application pending·0 cites
- 0551US9252118B2CMOS-compatible gold-free contactsJAIN SIDDHARTH·Filed 2011·Granted Feb 2, 2016·1 cites·15 claims
- 0650US2024103304A1Vertical pn junction photonics modulators with backside contacts and low temperature operationINTEL CORP·Filed 2022·Application pending·0 cites
- 0750US2010039729A1Package with integrated magnets for electromagnetically-actuated probe-storage deviceNANOCHIP INC·Filed 2008·Application pending·0 cites
- 0850US2023185022A1Lens with alignment facetsINTEL CORP·Filed 2021·Application pending·0 cites
- 0949US2007241448A1Electrically-isolated interconnects and seal rings in packages using a solder preformARANA LEONEL R·Filed 2007·Application pending·0 cites
- 1048US2008233672A1Method of integrating mems structures and cmos structures using oxide fusion bondingNANOCHIP INC·Filed 2007·Application pending·0 cites
- 1146US2007152026A1Transient liquid phase bonding methodSUH DAEWOONG·Filed 2005·Application pending·0 cites
- 1246US2006192281A1Methods for sealing chambers of microelectronic packagesLU DAOQIANG·Filed 2006·Application pending·0 cites
- 1342US2008090320A1Self sealed MEMS deviceHECK JOHN·Filed 2006·Application pending·0 cites
- 1441US2007235501A1Self-packaging MEMS deviceHECK JOHN·Filed 2006·Application pending·0 cites
- 1540US2006220223A1Reactive nano-layer material for MEMS packagingLU DAOQIANG·Filed 2005·Application pending·0 cites
- 1640US2006176126A1Manufacturing film bulk acoustic resonator filtersWANG LI-PENG·Filed 2006·Application pending·0 cites
- 1739US2005253282A1Temperature resistant hermetic sealing formed at low temperatures for MEMS packagesLU DAOQIANG·Filed 2004·Application pending·0 cites
- 1839US2005062120A1Packaging microelectromechanical structuresFiled 2004·Application pending·0 cites
- 1937US2005248424A1Composite beam microelectromechanical system switchCHOU TSUNG-KUAN·Filed 2004·Application pending·0 cites
- 2036US2004027030A1Manufacturing film bulk acoustic resonator filtersFiled 2002·Application pending·0 cites
- 2134US2003183916A1Packaging microelectromechanical systemsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →