Inventor · disambiguated record
Jongkook Kim
Also filed as: KIM JONGKOOK
15 granted patents·22 pending applications·71 citations·filing 2009–2024
91Inventor score
Top patents by PatentIndex Score
37 records- 0192US8354735B2Semiconductor chips having guard rings and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 15, 2013·16 cites·20 claims
- 0291US9425156B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 23, 2016·11 cites·22 claims
- 0390US11828791B2Test board and test apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·19 claims
- 0486US9252031B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·12 cites·21 claims
- 0583US10825776B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·18 claims
- 0683US8623743B2Semiconductor chips having guard rings and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 7, 2014·6 cites·20 claims
- 0781US9252095B2Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2013·Granted Feb 2, 2016·7 cites·28 claims
- 0880US9355931B2Package-on-package devices and methods of manufacturing the sameKIM JONGKOOK·Filed 2014·Granted May 31, 2016·8 cites·14 claims
- 0976US12388046B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 12, 2025·1 cites·15 claims
- 1076US10211159B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·2 cites·20 claims
- 1165US9899294B2Thermal interface material layer and package-on-package device including the sameNA MIN OK·Filed 2013·Granted Feb 20, 2018·2 cites·18 claims
- 1261US2025157958A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1361US2025062260A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1460US2024274579A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1560US2025046721A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1660US2024379635A13d integrated circuit (3dic) structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1760US2025022844A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1859US10950521B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1959US2024355794A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2059US2024258222A13d integrated circuit (3dic) structures and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2159US2024258221A13d integrated circuit (3dic) structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2259US2024355802A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2359US2024339411A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2459US2024395720A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2558US2024321851A1Semiconductor packages and method for manufacturing the sameSAMSUNG ELECTERONICS CO LTD·Filed 2023·Application pending·0 cites
- 2658US2025157867A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2757US2025167135A1Semiconductor package including a stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2857US2024290762A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2956US2024052496A1Composition for surface treatment of steel sheet and steel sheet using the samePOSCO CO LTD·Filed 2021·Application pending·0 cites
- 3055US10431522B2Thermal interface material layer and package-on-package device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 3153US8304876B2Semiconductor package and method for manufacturing the sameBYUN HAK-KYOON·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 3244US2015155216A1Semiconductor chip and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3342US2014374900A1Semiconductor package and method of fabricating the sameKWON HEUNGKYU·Filed 2014·Application pending·0 cites
- 3441US2016111347A1Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2015·Application pending·0 cites
- 3539US9370098B2Package substrates and integrated circuit packages including the sameJANG BYOUNG WOOK·Filed 2014·Granted Jun 14, 2016·0 cites·17 claims
- 3637US2015035148A1Semiconductor packages and methods of fabricating the sameLEE HEESEOK·Filed 2014·Application pending·0 cites
- 3735US2019164851A1Test interface board and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →