Inventor · disambiguated record
Joung Joo Lee
Also filed as: LEE JOUNG JOO
35 granted patents·42 pending applications·165 citations·filing 2004–2025
95Inventor score
Files withAPPLIED MATERIALS INC72APPLIED MATERUALS INC1FAIRCHILD KR SEMICONDUCTOR LTD1HA TAE-HONG1LEE JOUNG JOO1
Top patents by PatentIndex Score
77 records- 0198US9460959B1Methods for pre-cleaning conductive interconnect structuresAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·113 cites·18 claims
- 0295US12022650B2Low resistivity DRAM buried word line stackAPPLIED MATERIALS INC·Filed 2023·Granted Jun 25, 2024·2 cites·20 claims
- 0395US11810770B2Methods and apparatus for controlling ion fraction in physical vapor deposition processesAPPLIED MATERIALS INC·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 0494US11587936B2Low resistivity DRAM buried word line stackAPPLIED MATERIALS INC·Filed 2021·Granted Feb 21, 2023·2 cites·20 claims
- 0587US11037768B2Methods and apparatus for controlling ion fraction in physical vapor deposition processesAPPLIED MATERIALS INC·Filed 2017·Granted Jun 15, 2021·4 cites·8 claims
- 0686US9831074B2Bipolar collimator utilized in a physical vapor deposition chamberAPPLIED MATERIALS INC·Filed 2013·Granted Nov 28, 2017·3 cites·17 claims
- 0782US12094699B2Methods and apparatus for controlling ion fraction in physical vapor deposition processesAPPLIED MATERIALS INC·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0878US12281387B2Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 22, 2025·0 cites·5 claims
- 0978US11075165B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·2 cites·18 claims
- 1078US2025250675A1Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1177US10157733B2Methods for igniting a plasma in a substrate processing chamberAPPLIED MATERIALS INC·Filed 2017·Granted Dec 18, 2018·2 cites·19 claims
- 1277US8476162B2Methods of forming layers on substratesHA TAE HONG·Filed 2011·Granted Jul 2, 2013·4 cites·20 claims
- 1376US9953813B2Methods and apparatus for improved metal ion filteringAPPLIED MATERIALS INC·Filed 2015·Granted Apr 24, 2018·2 cites·20 claims
- 1472US12453086B2Low resistivity metal contact stackAPPLIED MATERIALS INC·Filed 2021·Granted Oct 21, 2025·0 cites·15 claims
- 1572US10815561B2Method and apparatus for asymmetric selective physical vapor depositionAPPLIED MATERIALS INC·Filed 2019·Granted Oct 27, 2020·1 cites·20 claims
- 1672US6954042B2Three-phase BLDC motor system and circuit and method for driving three-phase BLDC motorFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Oct 11, 2005·19 cites·18 claims
- 1771US9905443B2Reflective deposition rings and substrate processing chambers incorporating sameSUBRAMANI ANANTHA K·Filed 2012·Granted Feb 27, 2018·3 cites·18 claims
- 1871US9315891B2Methods for processing a substrate using multiple substrate support positionsAPPLIED MATERIALS INC·Filed 2013·Granted Apr 19, 2016·2 cites·10 claims
- 1970US8841211B2Methods for forming interconnect structuresLEE JOUNG JOO·Filed 2011·Granted Sep 23, 2014·4 cites·22 claims
- 2070US2024038859A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2168US2021071294A1Methods and apparatus for controlling ion fraction in physical vapor deposition processesAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2268US2023122969A1Method of depositing layersAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2366US2022325410A1Gap fill methods using catalyzed depositionAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2465US2024404888A1Dual silicide process using ruthenium silicideAPPLIED MATERUALS INC·Filed 2024·Application pending·0 cites
- 2564US11948885B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 2663US12315735B2Methods for removing etch stop layersAPPLIED MATERIALS INC·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 2762US12351909B2Gap fill methods using catalyzed depositionAPPLIED MATERIALS INC·Filed 2021·Granted Jul 8, 2025·0 cites·6 claims
- 2862US11776805B2Selective oxidation and simplified pre-cleanAPPLIED MATERIALS INC·Filed 2021·Granted Oct 3, 2023·0 cites·16 claims
- 2962US11562925B2Method of depositing multilayer stack including copper over features of a device structureAPPLIED MATERIALS INC·Filed 2020·Granted Jan 24, 2023·0 cites·12 claims
- 3062US2025051902A1Methods of forming conformal transition metal dichalcogenide filmsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3161US12094785B2Dual silicide process using ruthenium silicideAPPLIED MATERIALS INC·Filed 2021·Granted Sep 17, 2024·0 cites·15 claims
- 3261US2024331999A1Systems and methods for nanohole wet cleansAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3360US12183631B2Methods for copper doped hybrid metallization for line and viaAPPLIED MATERIALS INC·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 3460US2024332023A1Method of making silicide in high-aspect ratio structures by hybrid processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3560US2025316452A1Delivery of pulsed voltage waveforms to improve step coverage and damage controlAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3659US2025308909A1Method of making silicide in high-aspect ratio structures by h-radical assisted processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3759US2022231137A1Metal cap for contact resistance reductionAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3859US2024404803A1Microwave preclean apparatus and processing method for impurity removalAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3958US12104243B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 4058US2020219720A1Apparatus and methods for asymmetric deposition of metal on high aspect ratio nanostructuresAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4158US2025336665A1Electrochemical reduction of surface metal oxidesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4258US2025022750A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4357US2024360549A1Low-temperature deposition processes to form molybdenum-based materials with improved resistivityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4457US2025273454A1Microwave assisted passivation layer removalAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4557US2024371771A1Interruption layer fill for low resistance contactsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4657US2025329538A1Selective plasma assisted deposition of a molybdenum silicideAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4756US2024234209A1Contact resistance reduction by integration of molybdenum with titaniumAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4856US2023287022A1Non-Halide Oxygen-Free Organometallic Precursors for ALD/CVD of MetallizationAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4956US2025253191A1Methods of manufacturing interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 5055US10636655B2Methods for asymmetric deposition of metal on high aspect ratio nanostructuresAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·0 cites·14 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →