Inventor · disambiguated record
John F. Mccormack
Also filed as: MCCORMACK JOHN · MCCORMACK JOHN F
10 granted patents·239 citations·filing 1974–2020
90Inventor score
Top patents by PatentIndex Score
10 records- 0192US4301196AElectroless copper deposition process having faster plating ratesKOLLMORGEN TECH CORP·Filed 1980·Granted Nov 17, 1981·73 cites·22 claims
- 0278US3959531AImprovements in electroless metal platingPHOTOCIRCUITS CORP·Filed 1974·Granted May 25, 1976·20 cites·6 claims
- 0375US4604299AMetallization of ceramicsKOLLMORGEN TECH CORP·Filed 1984·Granted Aug 5, 1986·48 cites·32 claims
- 0470US4574094AMetallization of ceramicsKOLLMORGEN TECH CORP·Filed 1984·Granted Mar 4, 1986·33 cites·31 claims
- 0569US4814197AControl of electroless plating bathsKOLLMORGEN CORP·Filed 1986·Granted Mar 21, 1989·29 cites·22 claims
- 0665US7474967B2Computer-implemented methods, carrier media, and systems for detecting defects on a wafer based on multi-core architectureKLA TENCOR TECH CORP·Filed 2007·Granted Jan 6, 2009·4 cites·20 claims
- 0756US4701352ASurface preparation of ceramic substrates for metallizationKOLLMORGEN CORP·Filed 1984·Granted Oct 20, 1987·20 cites·19 claims
- 0852US11036147B2System and method for converting backside surface roughness to frontside overlayKLA CORP·Filed 2020·Granted Jun 15, 2021·0 cites·18 claims
- 0950US8111384B2Method for measuring thermo-optically induced material phase-change response in a multiple layer thin film structure using visible and ultraviolet spectroscopyYGARTUA CARLOS L·Filed 2009·Granted Feb 7, 2012·0 cites·20 claims
- 1045US4666744AProcess for avoiding blister formation in electroless metallization of ceramic substratesKOLLMORGEN TECH CORP·Filed 1984·Granted May 19, 1987·12 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →