Inventor · disambiguated record
John Mccormick
Also filed as: MCCORMICK JOHN · MCCORMICK JOHN P · MCCORMICK JOHN PIERRE
34 granted patents·1 pending application·1,588 citations·filing 1974–2021
98Inventor score
Files withLSI LOGIC CORP24AMKOR TECHNOLOGY INC3AMKOR TECH SINGAPORE HOLDING PTE LTD2AUTHORS FAMILY TRUST1CHIA CHOK1
Top patents by PatentIndex Score
35 records- 0198US6369448B1Vertically integrated flip chip semiconductor packageLSI LOGIC CORP·Filed 2000·Granted Apr 9, 2002·189 cites·15 claims
- 0295US6558978B1Chip-over-chip integrated circuit packageLSI LOGIC CORP·Filed 2001·Granted May 6, 2003·91 cites·8 claims
- 0394US9462690B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 4, 2016·15 cites·20 claims
- 0494US8536458B1Fine pitch copper pillar package and methodDARVEAUX ROBERT FRANCIS·Filed 2009·Granted Sep 17, 2013·27 cites·18 claims
- 0592US5909057AIntegrated heat spreader/stiffener with apertures for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Jun 1, 1999·142 cites·25 claims
- 0691US6166434ADie clip assembly for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Dec 26, 2000·128 cites·13 claims
- 0791US5831836APower plane for semiconductor deviceLSI LOGIC·Filed 1992·Granted Nov 3, 1998·150 cites·11 claims
- 0891US5801432AElectronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planesLSI LOGIC CORP·Filed 1996·Granted Sep 1, 1998·139 cites·27 claims
- 0988US10224270B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 5, 2019·4 cites·22 claims
- 1088US6294840B1Dual-thickness solder mask in integrated circuit packageLSI LOGIC CORP·Filed 1999·Granted Sep 25, 2001·70 cites·9 claims
- 1186US5552631ASemiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor dieLSI LOGIC CORP·Filed 1993·Granted Sep 3, 1996·67 cites·13 claims
- 1284US10418318B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 17, 2019·2 cites·20 claims
- 1384US5550406AMulti-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrateLSI LOGIC CORP·Filed 1993·Granted Aug 27, 1996·58 cites·14 claims
- 1482US6431432B1Method for attaching solderballs by selectively oxidizing tracesLSI LOGIC CORP·Filed 2000·Granted Aug 13, 2002·29 cites·3 claims
- 1582US5410451ALocation and standoff pins for chip on tapeLSI LOGIC CORP·Filed 1993·Granted Apr 25, 1995·67 cites·28 claims
- 1679US5763952AMulti-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling sameLSI LOGIC CORP·Filed 1996·Granted Jun 9, 1998·43 cites·47 claims
- 1778US6706622B1Bonding pad interfaceLSI LOGIC CORP·Filed 2001·Granted Mar 16, 2004·26 cites·18 claims
- 1878US5898575ASupport assembly for mounting an integrated circuit package on a surfaceLSI LOGIC CORP·Filed 1996·Granted Apr 27, 1999·51 cites·29 claims
- 1978US5681777AProcess for manufacturing a multi-layer tab tape semiconductor deviceLSI LOGIC CORP·Filed 1996·Granted Oct 28, 1997·39 cites·9 claims
- 2078US5638596AMethod of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power planeLSI LOGIC CORP·Filed 1995·Granted Jun 17, 1997·42 cites·6 claims
- 2177US8786075B1Electrical circuit with component-accommodating lidMIKS JEFFERY ALAN·Filed 2012·Granted Jul 22, 2014·8 cites·20 claims
- 2276US5639385AMethod of fabricating a wafer probe card for testing an integrated circuit dieLSI LOGIC CORP·Filed 1995·Granted Jun 17, 1997·37 cites·6 claims
- 2374US12191241B2Fine pitch copper pillar package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 7, 2025·0 cites·22 claims
- 2469US6002171AIntegrated heat spreader/stiffener assembly and method of assembly for semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Dec 14, 1999·38 cites·19 claims
- 2565US6008991AElectronic system including packaged integrated circuits with heat spreading standoff support membersLSI LOGIC CORP·Filed 1997·Granted Dec 28, 1999·34 cites·18 claims
- 2663US11088064B2Fine pitch copper pillar package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 2763US6171888B1Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling sameLSI LOGIC CORP·Filed 1998·Granted Jan 9, 2001·31 cites·1 claims
- 2860US7041516B2Multi chip module assemblyLSI LOGIC CORP·Filed 2002·Granted May 9, 2006·7 cites·19 claims
- 2957US5854085AMulti-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling sameLSI LOGIC CORP·Filed 1996·Granted Dec 29, 1998·24 cites·12 claims
- 3051US6943446B2Via construction for structural supportLSI LOGIC CORP·Filed 2002·Granted Sep 13, 2005·4 cites·4 claims
- 3148US3939699ATensiometer with remote sensing unitMCCORMICK JOHN P·Filed 1974·Granted Feb 24, 1976·10 cites·5 claims
- 3246US6777314B2Method of forming electrolytic contact pads including layers of copper, nickel, and goldLSI LOGIC CORP·Filed 2002·Granted Aug 17, 2004·1 cites·4 claims
- 3346USD341129SRemotely located controllerAUTHORS FAMILY TRUST·Filed 1992·Granted Nov 9, 1993·6 cites·1 claims
- 3440US5780924AIntegrated circuit underfill reservoirLSI LOGIC CORP·Filed 1996·Granted Jul 14, 1998·9 cites·13 claims
- 3531US2006113667A1Bond pad structure for gold wire bonding to copper low K dielectric silicon devicesCHIA CHOK·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →