Inventor · disambiguated record
Joyeeta Nag
Also filed as: NAG JOYEETA
24 granted patents·1 pending application·97 citations·filing 2014–2022
94Inventor score
Top patents by PatentIndex Score
25 records- 0196US9679810B1Integrated circuit having improved electromigration performance and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Jun 13, 2017·18 cites·15 claims
- 0295US9455185B1Laser anneal of buried metallic interconnects including through silicon viasIBM·Filed 2015·Granted Sep 27, 2016·16 cites·18 claims
- 0394US10395984B2Self-aligned via interconnect structuresIBM·Filed 2016·Granted Aug 27, 2019·22 cites·20 claims
- 0493US11031435B2Memory device containing ovonic threshold switch material thermal isolation and method of making the sameWESTERN DIGITAL TECH INC·Filed 2019·Granted Jun 8, 2021·6 cites·12 claims
- 0592US9412654B1Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating stepIBM·Filed 2015·Granted Aug 9, 2016·9 cites·20 claims
- 0690US11996462B2Ferroelectric field effect transistors having enhanced memory window and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 28, 2024·2 cites·5 claims
- 0787US9472710B1Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrateIBM·Filed 2015·Granted Oct 18, 2016·5 cites·7 claims
- 0884US9412658B2Constrained nanosecond laser anneal of metal interconnect structuresIBM·Filed 2014·Granted Aug 9, 2016·7 cites·19 claims
- 0978US10727122B2Self-aligned via interconnect structuresIBM·Filed 2014·Granted Jul 28, 2020·4 cites·24 claims
- 1078US9373561B1Integrated circuit barrierless microfluidic channelIBM·Filed 2014·Granted Jun 21, 2016·3 cites·10 claims
- 1177US9362230B1Methods to form conductive thin film structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 7, 2016·2 cites·20 claims
- 1268US9431485B2Formation of finFET junctionGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 30, 2016·2 cites·16 claims
- 1365US9784917B2Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrateIBM·Filed 2015·Granted Oct 10, 2017·1 cites·13 claims
- 1460US12363905B2Memory device containing composition-controlled ferroelectric memory elements and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Jul 15, 2025·0 cites·10 claims
- 1559US12356627B2Memory device containing composition-controlled ferroelectric memory elements and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Jul 8, 2025·0 cites·22 claims
- 1658US11348832B2Self-aligned via interconnect structuresIBM·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 1754US11545506B2Ferroelectric field effect transistors having enhanced memory window and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 1854US9502325B2Integrated circuit barrierless microfluidic channelIBM·Filed 2016·Granted Nov 22, 2016·0 cites·1 claims
- 1953US12362301B2Bonded memory devices and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jul 15, 2025·0 cites·20 claims
- 2052US9385062B1Integrated circuit barrierless microfluidic channelIBM·Filed 2016·Granted Jul 5, 2016·0 cites·1 claims
- 2148US9620396B1Laser anneal of buried metallic interconnects including through silicon viasIBM·Filed 2016·Granted Apr 11, 2017·0 cites·9 claims
- 2248US2017236780A1Integrated circuit having improved electromigration performance and method of forming sameGLOBALFOUNDRIES INC·Filed 2017·Application pending·0 cites
- 2347US9293365B2Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishingIBM·Filed 2014·Granted Mar 22, 2016·0 cites·20 claims
- 2438US9748235B2Gate stack for integrated circuit structure and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 29, 2017·0 cites·20 claims
- 2536US9793216B2Fabrication of IC structure with metal plugGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 17, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →