Inventor · disambiguated record
Jong Hwi Park
Also filed as: PARK JONG HWI
34 granted patents·14 pending applications·12 citations·filing 2016–2023
93Inventor score
Top patents by PatentIndex Score
48 records- 0197US10822720B1Composition for preparing silicon carbide ingot and method for preparing silicon carbide ingot using the sameSKC CO LTD·Filed 2020·Granted Nov 3, 2020·6 cites·7 claims
- 0290US11359306B2Method for preparing a SiC ingot and device for preparing a SiC ingot wherein electrical resistance of crucible body is 2.9 ohms or moreSENIC INC·Filed 2020·Granted Jun 14, 2022·2 cites·3 claims
- 0380US11708644B2Method for preparing SiC ingot, method for preparing SiC wafer and the SiC wafer prepared therefromSENIC INC·Filed 2020·Granted Jul 25, 2023·1 cites·7 claims
- 0480US10000831B2Highly durable coil spring steelHYUNDAI MOTOR CO LTD·Filed 2016·Granted Jun 19, 2018·1 cites·7 claims
- 0577US12359344B2Silicon carbide powder and method for manufacturing silicon carbide ingot using the sameSENIC INC·Filed 2022·Granted Jul 15, 2025·0 cites·9 claims
- 0672US12183291B2Pixel driving circuit for display panelLX SEMICON CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 0772US11862685B2Wafer and method of manufacturing waferSENIC INC·Filed 2022·Granted Jan 2, 2024·0 cites·8 claims
- 0872US2022220632A1Silicon carbide ingot manufacturing method and silicon carbide ingot manufactured therebySENIC INC·Filed 2022·Application pending·0 cites
- 0971US11339497B2Silicon carbide ingot manufacturing method and silicon carbide ingot manufactured therebySENIC INC·Filed 2021·Granted May 24, 2022·0 cites·5 claims
- 1071US10479050B2Method of preparing conductive magnetic composite sheet and antenna deviceSKC CO LTD·Filed 2017·Granted Nov 19, 2019·2 cites·19 claims
- 1170US2024076799A1Wafer manufacturing method, epitaxial wafer manufacturing method, and wafer and epitaxial wafer manufactured therebySENIC INC·Filed 2023·Application pending·0 cites
- 1269US11566344B2Silicon carbide ingot, wafer, method for producing a silicon carbide ingot, and method for manufacturing a waferSENIC INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1369US2024059570A1Silicon carbide powder, method for manufacturing the same and method for manufacturing silicon carbide ingot using the sameSENIC INC·Filed 2023·Application pending·0 cites
- 1468US11532284B2Pixel driving circuit for display panelLX SEMICON CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·15 claims
- 1566US2022341055A1Silicon carbide ingot, method of preparing the same, and method for preparing silicon carbide waferSENIC INC·Filed 2022·Application pending·0 cites
- 1665US12325933B2Silicon carbide powder, method for manufacturing silicon carbide ingot using the same, and silicon carbide waferSENIC INC·Filed 2022·Granted Jun 10, 2025·0 cites·4 claims
- 1764US12037704B2Silicon carbide wafer and method of manufacturing sameSENIC INC·Filed 2022·Granted Jul 16, 2024·0 cites·14 claims
- 1864US11289576B2Wafer and method of manufactruring waferSENIC INC·Filed 2021·Granted Mar 29, 2022·0 cites·12 claims
- 1964US2024060212A1Silicon carbide powder, method for manufacturing the same and method for manufacturing silicon carbide ingot using the sameSENIC INC·Filed 2023·Application pending·0 cites
- 2063US11541634B2Graphite sheet and method for manufacturing sameSKC CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·6 claims
- 2163US11474012B2Method for preparing silicon carbide wafer and silicon carbide waferSENIC INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 2263US2023322099A1Electric vehicle and pad assembly with composite type magnetic complex materialSKC CO LTD·Filed 2023·Application pending·0 cites
- 2362US12002402B2Latch circuit for reducing noise based on center grayscale and data driver including the sameLX SEMICON CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 2462US11466383B2Silicon carbide ingot, method of preparing the same, and method for preparing silicon carbide waferSENIC INC·Filed 2020·Granted Oct 11, 2022·0 cites·4 claims
- 2559US12270122B2Silicon carbide wafer and semiconductor deviceSENIC INC·Filed 2022·Granted Apr 8, 2025·0 cites·10 claims
- 2659US11939698B2Wafer manufacturing method, epitaxial wafer manufacturing method, and wafer and epitaxial wafer manufactured therebySENIC INC·Filed 2020·Granted Mar 26, 2024·0 cites·6 claims
- 2759US11856678B2Method of measuring a graphite article, apparatus for a measurement, and ingot growing systemSENIC INC·Filed 2020·Granted Dec 26, 2023·0 cites·19 claims
- 2858US12320033B2Silicon carbide wafer and method of preparing the sameSENIC INC·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 2958US11749167B2Data drive circuit, clock recovery method of the same, and display drive device having the sameLX SEMICON CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 3058US11646209B2Method of cleaning wafer and wafer with reduced impuritiesSENIC INC·Filed 2021·Granted May 9, 2023·0 cites·4 claims
- 3157US12136653B2Silicon carbide wafer and semiconductor device applied the sameSENIC INC·Filed 2022·Granted Nov 5, 2024·0 cites·7 claims
- 3257US2024076191A1Silicon carbide powder and method for manufacturing silicon carbide ingot using the sameSENIC INC·Filed 2023·Application pending·0 cites
- 3356US11795572B2Method of manufacturing a silicon carbide ingot comprising moving a heater surrounding a reactor to induce silicon carbide raw materials to sublimate and growing the silicon carbide ingot on a seed crystalSENIC INC·Filed 2021·Granted Oct 24, 2023·0 cites·4 claims
- 3455US11969917B2Manufacturing method of silicon carbide wafer, silicon carbide wafer and system for manufacturing waferSENIC INC·Filed 2022·Granted Apr 30, 2024·0 cites·7 claims
- 3554US11591711B2Method and system for producing silicon carbide ingotSENIC INC·Filed 2020·Granted Feb 28, 2023·0 cites·11 claims
- 3654US10487382B2High strength special steelHYUNDAI MOTOR CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·7 claims
- 3754US2025084561A1Method of manufacturing silicon carbide wafer and method of manufacturing silicon carbide ingotSENIC INC·Filed 2022·Application pending·0 cites
- 3851US11447889B2Adhesive layer of seed crystal, method for preparing a laminate using the same, and method for preparing a waferSENIC INC·Filed 2020·Granted Sep 20, 2022·0 cites·8 claims
- 3950US12026764B2Method and apparatus for providing information using trained model based on machine learningEMRO CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·12 claims
- 4049US2018163287A1Coil spring steelHYUNDAI MOTOR CO LTD·Filed 2017·Application pending·0 cites
- 4148US10593452B2Magnetic sheet and antenna device comprising sameSKC CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·20 claims
- 4245US11040516B2Graphite sheet and method for manufacturing sameSKC CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·4 claims
- 4345US2022164705A1Method and apparatus for providing information based on machine learningEMRO CO LTD·Filed 2021·Application pending·0 cites
- 4445US2017159159A1Coil spring steelHYUNDAI MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 4545US2021272793A1Wafer, epitaxial wafer, method for manufacturing a wafer and method for manufacturing an epitaxial waferSKC CO LTD·Filed 2021·Application pending·0 cites
- 4645US2022164849A1Method and apparatus for classifying item based on machine learningEMRO CO LTD·Filed 2021·Application pending·0 cites
- 4744US2022164851A1Method and apparatus for providing information about similar items based on machine learningEMRO CO LTD·Filed 2021·Application pending·0 cites
- 4837US10622719B2Antenna device and portable terminal comprising sameSKC CO LTD·Filed 2017·Granted Apr 14, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →