Inventor · disambiguated record
Jonathan D. Reid
Also filed as: REID JONATHAN · REID JONATHAN D · REID JONATHAN DAVID
106 granted patents·22 pending applications·5,334 citations·filing 1988–2024
99Inventor score
Top patents by PatentIndex Score
128 records- 0199US6527920B1Copper electroplating apparatusNOVELLUS SYSTEMS INC·Filed 2000·Granted Mar 4, 2003·251 cites·36 claims
- 0298US7622024B1High resistance ionic current sourceNOVELLUS SYSTEMS INC·Filed 2005·Granted Nov 24, 2009·83 cites·28 claims
- 0398US6890416B1Copper electroplating method and apparatusNOVELLUS SYSTEMS INC·Filed 2002·Granted May 10, 2005·92 cites·31 claims
- 0498US6569299B1Membrane partition system for plating of wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted May 27, 2003·101 cites·14 claims
- 0598US6179983B1Method and apparatus for treating surface including virtual anodeNOVELLUS SYSTEMS INC·Filed 1997·Granted Jan 30, 2001·341 cites·34 claims
- 0698US6126798AElectroplating anode including membrane partition system and method of preventing passivation of sameNOVELLUS SYSTEMS INC·Filed 1997·Granted Oct 3, 2000·259 cites·38 claims
- 0798US6074544AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1998·Granted Jun 13, 2000·288 cites·7 claims
- 0897US12089953B1Systems and methods for utilizing intrinsic current noise to measure interface impedancesMETA PLATFORMS TECH LLC·Filed 2020·Granted Sep 17, 2024·6 cites·20 claims
- 0997US8043958B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2010·Granted Oct 25, 2011·26 cites·13 claims
- 1097US7967969B2Method of electroplating using a high resistance ionic current sourceNOVELLUS SYSTEMS INC·Filed 2009·Granted Jun 28, 2011·50 cites·19 claims
- 1197US7854828B2Method and apparatus for electroplating including remotely positioned second cathodeNOVELLUS SYSTEMS INC·Filed 2006·Granted Dec 21, 2010·50 cites·20 claims
- 1297US6773571B1Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sourcesNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 10, 2004·144 cites·45 claims
- 1397US6551487B1Methods and apparatus for controlled-angle wafer immersionNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·145 cites·16 claims
- 1497US6458262B1Electroplating chemistry on-line monitoring and control systemNOVELLUS SYSTEMS INC·Filed 2001·Granted Oct 1, 2002·79 cites·36 claims
- 1597US6193859B1Electric potential shaping apparatus for holding a semiconductor wafer during electroplatingNOVELLUS SYSTEMS INC·Filed 1998·Granted Feb 27, 2001·159 cites·29 claims
- 1697US6159354AElectric potential shaping method for electroplatingNOVELLUS SYSTEMS INC·Filed 1997·Granted Dec 12, 2000·182 cites·12 claims
- 1797US6110346AMethod of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Aug 29, 2000·158 cites·9 claims
- 1896US9481942B2Geometry and process optimization for ultra-high RPM platingLAM RES CORP·Filed 2015·Granted Nov 1, 2016·9 cites·26 claims
- 1996US8128791B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2006·Granted Mar 6, 2012·39 cites·24 claims
- 2096US7605082B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2005·Granted Oct 20, 2009·36 cites·14 claims
- 2196US6800187B1Clamshell apparatus for electrochemically treating wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Oct 5, 2004·168 cites·45 claims
- 2296US6551483B1Method for potential controlled electroplating of fine patterns on semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·110 cites·18 claims
- 2395US9309604B2Method and apparatus for electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 12, 2016·18 cites·20 claims
- 2495US8709948B2Tungsten barrier and seed for copper filled TSVDANEK MICHAL·Filed 2010·Granted Apr 29, 2014·36 cites·25 claims
- 2595US8623193B1Method of electroplating using a high resistance ionic current sourceMAYER STEVEN T·Filed 2011·Granted Jan 7, 2014·20 cites·17 claims
- 2695US8513124B1Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 20, 2013·30 cites·22 claims
- 2795US8475644B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·36 cites·20 claims
- 2895US7964506B1Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafersNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 21, 2011·60 cites·29 claims
- 2995US7686927B1Methods and apparatus for controlled-angle wafer positioningNOVELLUS SYSTEMS INC·Filed 2006·Granted Mar 30, 2010·26 cites·7 claims
- 3095US7449098B1Method for planar electroplatingNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 11, 2008·110 cites·39 claims
- 3195US7033465B1Clamshell apparatus with crystal shielding and in-situ rinse-dryNOVELLUS SYSTEMS INC·Filed 2002·Granted Apr 25, 2006·48 cites·31 claims
- 3295US6162344AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Dec 19, 2000·179 cites·9 claims
- 3395US6099702AElectroplating chamber with rotatable wafer holder and pre-wetting and rinsing capabilityNOVELLUS SYSTEMS INC·Filed 1998·Granted Aug 8, 2000·203 cites·10 claims
- 3494US9045841B1Control of electrolyte composition in a copper electroplating apparatusBUCKALEW BRYAN·Filed 2012·Granted Jun 2, 2015·9 cites·19 claims
- 3594US8475636B2Method and apparatus for electroplatingMAYER STEVEN·Filed 2009·Granted Jul 2, 2013·30 cites·19 claims
- 3694US8268155B1Copper electroplating solutions with halidesZHOU JIAN·Filed 2009·Granted Sep 18, 2012·15 cites·21 claims
- 3794US7776741B2Process for through silicon via filingNOVELLUS SYSTEMS INC·Filed 2008·Granted Aug 17, 2010·43 cites·30 claims
- 3894US7727863B1Sonic irradiation during wafer immersionNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 1, 2010·33 cites·25 claims
- 3994US7232513B1Electroplating bath containing wetting agent for defect reductionNOVELLUS SYSTEMS INC·Filed 2004·Granted Jun 19, 2007·51 cites·16 claims
- 4094US6821407B1Anode and anode chamber for copper electroplatingNOVELLUS SYSTEMS INC·Filed 2002·Granted Nov 23, 2004·97 cites·25 claims
- 4194US6793796B2Electroplating process for avoiding defects in metal features of integrated circuit devicesNOVELLUS SYSTEMS INC·Filed 2001·Granted Sep 21, 2004·92 cites·22 claims
- 4294US6554914B1Passivation of copper in dual damascene metalizationNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 29, 2003·62 cites·27 claims
- 4394US4969979ADirect electroplating of through holesIBM·Filed 1989·Granted Nov 13, 1990·66 cites·18 claims
- 4493US10687759B2Shielding techniques for noise reduction in surface electromyography signal measurement and related systems and methodsFACEBOOK TECH LLC·Filed 2019·Granted Jun 23, 2020·19 cites·14 claims
- 4593US8703615B1Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafersPONNUSWAMY THOMAS A·Filed 2012·Granted Apr 22, 2014·21 cites·24 claims
- 4693US8415261B1Capping before barrier-removal IC fabrication methodREID JONATHAN D·Filed 2011·Granted Apr 9, 2013·12 cites·6 claims
- 4793US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
- 4893US8168540B1Methods and apparatus for depositing copper on tungstenREID JONATHAN·Filed 2009·Granted May 1, 2012·29 cites·30 claims
- 4993US8048280B2Process for electroplating metals into microscopic recessed featuresNOVELLUS SYSTEMS INC·Filed 2005·Granted Nov 1, 2011·24 cites·34 claims
- 5093US7811925B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2008·Granted Oct 12, 2010·16 cites·20 claims
Showing the top 50 of 128 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →