Inventor · disambiguated record
John Riley
Also filed as: RILEY III JOHN B · RILEY JOHN · RILEY JOHN B · RILEY JOHN B III
10 granted patents·5 pending applications·870 citations·filing 1996–2022
92Inventor score
Files withTESSERA INC11HABA BELGACEM1NAT SEMICONDUCTOR CORP1SIEMENS INDUSTRY INC1TARA MEDICAL DEVICES LLC1
Top patents by PatentIndex Score
15 records- 0198US8329581B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted Dec 11, 2012·45 cites·17 claims
- 0298US7453157B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted Nov 18, 2008·101 cites·36 claims
- 0397US5856911AAttachment assembly for integrated circuitsNAT SEMICONDUCTOR CORP·Filed 1996·Granted Jan 5, 1999·386 cites·14 claims
- 0496US7294928B2Components, methods and assemblies for stacked packagesTESSERA INC·Filed 2003·Granted Nov 13, 2007·151 cites·26 claims
- 0595US7745943B2Microelectonic packages and methods thereforTESSERA INC·Filed 2007·Granted Jun 29, 2010·32 cites·29 claims
- 0692US7149095B2Stacked microelectronic assembliesTESSERA INC·Filed 2002·Granted Dec 12, 2006·65 cites·35 claims
- 0792US6885106B1Stacked microelectronic assemblies and methods of making sameTESSERA INC·Filed 2002·Granted Apr 26, 2005·78 cites·60 claims
- 0884US7999397B2Microelectronic packages and methods thereforTESSERA INC·Filed 2010·Granted Aug 16, 2011·5 cites·17 claims
- 0978US7935569B2Components, methods and assemblies for stacked packagesTESSERA INC·Filed 2007·Granted May 3, 2011·7 cites·16 claims
- 1050US2025026218A1Overhead power distribution systems and methods for modular expandable outdoor buswaySIEMENS INDUSTRY INC·Filed 2022·Application pending·0 cites
- 1149US2009071707A1Multilayer substrate with interconnection vias and method of manufacturing the sameTESSERA INC·Filed 2008·Application pending·0 cites
- 1242US11344328B2Devices, systems, and methods for epidermal tissue harvestingTARA MEDICAL DEVICES LLC·Filed 2019·Granted May 31, 2022·0 cites·22 claims
- 1341US2007138612A1Stackable electronic device assembly and high G-force test fixtureTESSERA INC·Filed 2006·Application pending·0 cites
- 1440US2008105963A1Stackable electronic device assemblyTESSERA INC·Filed 2007·Application pending·0 cites
- 1536US2003048624A1Low-height multi-component assembliesTESSERA INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →