Inventor · disambiguated record
John M. Rush
Also filed as: RUSH JOHN · RUSH JOHN M
12 granted patents·681 citations·filing 1991–2002
93Inventor score
Top patents by PatentIndex Score
12 records- 0195US5193969AWafer transfer machineFORTREND ENGINEERING CORP·Filed 1991·Granted Mar 16, 1993·362 cites·9 claims
- 0285US6494666B2Simplified and enhanced SCARA armFORTREND ENGINEERING CORP·Filed 2001·Granted Dec 17, 2002·42 cites·13 claims
- 0385US5870488AMethod and apparatus for prealigning wafers in a wafer sorting systemFORTREND ENGINEERING CORP·Filed 1996·Granted Feb 9, 1999·110 cites·2 claims
- 0478US5934991APod loader interface improved clean air systemFORTREND ENGINEERING CORP·Filed 1998·Granted Aug 10, 1999·59 cites·12 claims
- 0571US5984610APod loader interfaceFORTREND ENGINEERING CORP·Filed 1995·Granted Nov 16, 1999·39 cites·19 claims
- 0659US5885045AIntegrated wafer pod-load/unload and mass-transfer systemFORTREND ENGINEERING CORP·Filed 1998·Granted Mar 23, 1999·22 cites·14 claims
- 0757US6655423B2Unified pod quick-opening apparatusFORTREND TAIWAN SCIENT CORP·Filed 2002·Granted Dec 2, 2003·8 cites·5 claims
- 0850US6592317B1Pod loader interface end effectorsASYST TECHNOLOGIES·Filed 2000·Granted Jul 15, 2003·3 cites·39 claims
- 0949US6698992B2Elastically expandable positioning deviceFORTREND TAIWAN SCIENT CORP·Filed 2002·Granted Mar 2, 2004·4 cites·9 claims
- 1049US6193459B1Integrated wafer pod-load/unload and mass-transfer systemFORTREND ENGINEERING CORP·Filed 1999·Granted Feb 27, 2001·14 cites·24 claims
- 1147US6086323AMethod for supplying wafers to an IC manufacturing processFORTREND ENGINEERING CORP·Filed 1999·Granted Jul 11, 2000·12 cites·62 claims
- 1231US5506744AIonized airflow manifold for static reductionFORTREND ENG·Filed 1994·Granted Apr 9, 1996·6 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when John M. Rush files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →