Inventor · disambiguated record
Joung Gul Ryu
Also filed as: RYU JOUNG-GUL
37 granted patents·17 pending applications·38 citations·filing 2008–2023
95Inventor score
Top patents by PatentIndex Score
54 records- 0189US10923266B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 16, 2021·3 cites·20 claims
- 0289US10553346B2Thin film inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 4, 2020·3 cites·15 claims
- 0387US7893527B2Semiconductor plastic package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·14 cites·11 claims
- 0486US12293867B2Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Granted May 6, 2025·0 cites·25 claims
- 0585US11158453B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 26, 2021·2 cites·32 claims
- 0682US11145452B2Inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 12, 2021·2 cites·12 claims
- 0782US11094458B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 17, 2021·2 cites·8 claims
- 0877US10984942B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 20, 2021·1 cites·15 claims
- 0977US8647926B2Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chipSHIN JOON-SIK·Filed 2010·Granted Feb 11, 2014·4 cites·15 claims
- 1075US11862386B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 2, 2024·0 cites·13 claims
- 1171US12046413B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 23, 2024·0 cites·32 claims
- 1268US11107622B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 31, 2021·0 cites·13 claims
- 1364US10998125B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted May 4, 2021·0 cites·20 claims
- 1463US12224100B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 11, 2025·0 cites·21 claims
- 1563US8499441B2Method of manufacturing a printed circuit boardPARK JUNG-HWAN·Filed 2008·Granted Aug 6, 2013·2 cites·12 claims
- 1662US11721475B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 8, 2023·0 cites·18 claims
- 1761US8704100B2Heat dissipating substrate and method of manufacturing the sameLEE SANG YOUP·Filed 2010·Granted Apr 22, 2014·2 cites·2 claims
- 1860US11037718B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 15, 2021·0 cites·20 claims
- 1960US8397378B2Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit boardSOHN KEUNG-JIN·Filed 2008·Granted Mar 19, 2013·2 cites·15 claims
- 2059US11721473B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 8, 2023·0 cites·19 claims
- 2158US2009236038A1Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2257US12033784B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 9, 2024·0 cites·14 claims
- 2357US11830655B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 28, 2023·0 cites·20 claims
- 2457US11127523B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 21, 2021·0 cites·20 claims
- 2557US9456492B2Printed circuit board with warpage prevention layerSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 27, 2016·0 cites·9 claims
- 2656US11398343B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 26, 2022·0 cites·16 claims
- 2756US10796840B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 6, 2020·0 cites·18 claims
- 2856US8997340B2Method of manufacturing and insulating sheetSOHN KEUNGJIN·Filed 2011·Granted Apr 7, 2015·1 cites·22 claims
- 2955US11923124B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 5, 2024·0 cites·15 claims
- 3055US11380475B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 5, 2022·0 cites·15 claims
- 3155US2009250253A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3254US11830662B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 28, 2023·0 cites·18 claims
- 3353US2012012379A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 3453US2012030938A1Method of manufacturing printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 3553US2012018195A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 3652US8926714B2Heat dissipating substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 6, 2015·0 cites·4 claims
- 3751US11574765B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 7, 2023·0 cites·19 claims
- 3851US11488762B2Chip inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 1, 2022·0 cites·22 claims
- 3950US2011139499A1Printed circuit board and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 4050US2009242248A1Insulating sheet and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4150US2015136446A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4249US11664154B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted May 30, 2023·0 cites·18 claims
- 4349US10741321B2Thin film type inductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 11, 2020·0 cites·15 claims
- 4449US8450618B2Printed circuit board with reinforced thermoplastic resin layerSOHN KEUNG-JIN·Filed 2011·Granted May 28, 2013·0 cites·4 claims
- 4548US2009288293A1Metal core package substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4647US2015041206A1Laminate for printed circuit board, printed circuit board using the same, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4747US2014124434A1FilterSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4846US10707009B2Thin film-type inductorSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 7, 2020·0 cites·17 claims
- 4943US2014041907A1Core substrate and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 5042US2018350505A1Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →