Printed circuit board and manufacturing method of the same

Abstract

A printed circuit board the includes: an insulation layer; a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer; an inner substrate having the insulation layer stacked therein and having a second circuit pattern including a second electrode pad formed thereon; a conductive post buried in the insulation layer such that one end thereof is connected to the first electrode pad and the other end thereof is connected to the second electrode pad; and a solder resist layer stacked on the insulation layer.

1 . A printed circuit board comprising:
 an insulation layer;   a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer;   an inner substrate having the insulation layer stacked therein and having a second circuit pattern including a second electrode pad formed thereon;   a conductive post buried in the insulation layer such that one end thereof is connected to the first electrode pad and the other end thereof is connected to the second electrode pad; and   a solder resist layer stacked on the insulation layer.   
     
     
         2 . The printed circuit board of  claim 1 , further comprising:
 an aperture formed in the solder resist layer and configured to open the first electrode pad; and   a surface-treatment part formed on the first electrode pad.   
     
     
         3 . The printed circuit board of  claim 2 , further comprising:
 a solder bump formed on the surface-treatment part.   
     
     
         4 . The printed circuit board of  claim 1 , wherein the solder resist layer contains a liquid crystal polymer. 
     
     
         5 . The printed circuit board of  claim 1 , wherein the insulation layer is made of a liquid crystal polymer resin or a prepreg formed by impregnating glass fibers in a liquid crystal polymer resin. 
     
     
         6 . The printed circuit board of  claim 1 , wherein the inner substrate is formed by impregnating glass fibers in a liquid crystal polymer resin.