Inventor · disambiguated record
Keungjin Sohn
Also filed as: SOHN KEUNGJIN
6 granted patents·5 pending applications·28 citations·filing 2008–2012
80Inventor score
Top patents by PatentIndex Score
11 records- 0187US7893527B2Semiconductor plastic package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·14 cites·11 claims
- 0278US8174128B2Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip methodIKEGUCHI NOBUYUKI·Filed 2010·Granted May 8, 2012·5 cites·18 claims
- 0377US8647926B2Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chipSHIN JOON-SIK·Filed 2010·Granted Feb 11, 2014·4 cites·15 claims
- 0463US8499441B2Method of manufacturing a printed circuit boardPARK JUNG-HWAN·Filed 2008·Granted Aug 6, 2013·2 cites·12 claims
- 0563US8030752B2Method of manufacturing semiconductor package and semiconductor plastic package using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 0658US2009236038A1Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0756US8997340B2Method of manufacturing and insulating sheetSOHN KEUNGJIN·Filed 2011·Granted Apr 7, 2015·1 cites·22 claims
- 0850US2011139499A1Printed circuit board and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 0950US2009242248A1Insulating sheet and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1047US2009008136A1Multilayered printed circuit board and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1144US2012174393A1Method of fabricating multilayered printed circuit boardIKEGUCHI NOBUYUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →